Stacked Antenna Module for Millimeter Wave Signal Reliability
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Solution Overview
Problem
Millimeter wave communications face significant challenges due to signal absorption and reflection in high-frequency bands, leading to deteriorated transmission quality as distance increases, requiring specialized antenna technologies to maintain effective isotropic radiated power (EIRP) and antenna gain.
Innovation Solution
The antenna module incorporates a stacked structure with multiple patch antenna packages and a connection member featuring flexible signal path dielectric layers, allowing for efficient transmission and reception of RF signals in various directions, including beyond the conventional z-axis, by utilizing a combination of patch antenna patterns, coupling structures, and dielectric layers to reduce transmission loss and enhance gain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional antenna structure is used for millimeter wave communications, then the device structure is simple, but signal absorption and reflection occur in high-frequency bands leading to deteriorated transmission quality
Solution Approach 1:
The antenna module is divided into multiple antenna packages (first antenna package, second antenna package, third antenna package) with different orientations. Each package contains patch antenna patterns arranged in specific directions, allowing the system to transmit and receive signals in multiple directions simultaneously, thereby improving transmission quality in high-frequency bands by overcoming signal absorption and reflection issues.
Solution Approach 2:
The patent transitions from a conventional single-plane antenna arrangement to a three-dimensional stacked structure with antenna packages positioned at different heights and orientations. The connection member provides vertical stacking with first, second, and third regions, enabling signals to propagate in multiple spatial dimensions (x, y, z axes), which improves transmission reliability by providing alternative signal paths that avoid absorption and reflection problems.
2Reliability
If multiple antenna packages are stacked to improve signal transmission in multiple directions, then transmission quality improves, but the device complexity increases
Solution Approach 1:
Multiple antenna packages are merged into a single integrated antenna module through the connection member. The first antenna package, second antenna package, and third antenna package are combined with the IC package in a stacked configuration, sharing common support structures and electrical connection paths. This merging approach maintains signal transmission reliability while reducing overall structural complexity compared to separate antenna systems.
Solution Approach 2:
The connection member serves multiple functions: it provides mechanical support for stacking antenna packages, establishes electrical connections between IC and antenna feeds, and enables signal routing in multiple directions. The IC package itself handles multiple functions including signal processing and distribution to different antenna packages, reducing the need for additional dedicated components and simplifying the overall system architecture.
3Reliability
If patch antenna patterns are arranged in different directions to enable multi-directional communication, then communication quality improves, but manufacturing precision requirements increase
Solution Approach 1:
The patch antenna patterns are pre-configured in specific orientations within each antenna package during manufacturing. The first antenna package contains patterns oriented in a first direction, the second antenna package contains patterns oriented in a second direction, and the third antenna package contains patterns oriented in a third direction. This preliminary arrangement of antenna patterns in predetermined orientations simplifies the overall assembly process and reduces the precision requirements during final integration, as the directional characteristics are already established in each package.
Data Source
AI summary
An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.