Stacked Antenna Module for Slim Device Beam Coverage
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Solution Overview
Problem
Next-generation wireless communication systems face challenges in securing mounting space within slim electronic devices for antenna modules that require beam patterns in multiple directions, especially when using high-frequency bands like mmWave, due to space constraints and the need for efficient antenna gain.
Innovation Solution
An antenna module is designed with antenna elements arranged on a PCB to form beam patterns in different directions, utilizing a combination of conductive patch and dipole antennas, and featuring conductive contacts for electrical connection, allowing for efficient space utilization and beam coverage expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna elements are arranged side by side on a single PCB to form beam patterns, then beam pattern formation capability is improved, but mounting space requirement increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of antenna elements on a single PCB to a three-dimensional structure where antenna elements are arranged on multiple stacked PCBs. This vertical stacking enables beam pattern formation while reducing the horizontal mounting area, as the antenna elements utilize the third dimension (height) for spatial arrangement rather than requiring extensive lateral space.
2Adaptability or versatility
If multiple antenna elements are arranged to form beam patterns in different directions, then directional beam coverage is improved, but device thickness increases
Solution Approach 1:
The patent implements a nested structure where multiple PCBs carrying antenna elements are stacked vertically and integrated within a compact housing. The antenna modules are nested one above another, with conductive contacts and connection structures that allow electrical connectivity between stacked layers. This nesting approach enables multi-directional beam coverage while minimizing the overall device thickness by efficiently utilizing vertical space.
3Productivity
If antenna module is designed for high-frequency bands like mmWave, then communication capacity is improved, but mounting space constraint increases
Solution Approach 1:
The patent addresses the mounting space constraint for high-frequency mmWave antenna modules by transitioning from horizontal planar arrangement to vertical three-dimensional stacking. This dimensional change allows the antenna elements to be arranged in space-efficient configurations that support mmWave frequencies while requiring minimal mounting area on the device PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables secure mounting within slim electronic devices while forming directional beams across various frequencies, enhancing communication efficiency and coverage without compromising device thickness.
Implementation Method 1
antenna elements are arranged to form beam patterns in different directions
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, and a printed circuit board (PCB) disposed in an inner space of the housing and includes at least one first conductive contact exposed at least partially and electrically connected to a wireless communication circuit; and an antenna structure disposed on the PCB, including at least one first antenna element and at least one second conductive contact exposed at least partially and electrically connected to the at least one first antenna element. The at least one first conductive contact is electrically connected to the at least one second conductive contact when the antenna structure is combined with the PCB. The wireless communication circuit is configured to form a directional beam through the at least one first antenna element.