Stacked Antenna Electronic Package for 5G Resonance and Bandwidth
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Solution Overview
Problem
Conventional wireless communication modules face limitations in providing the electrical functions required for 5G systems due to fixed substrate dimensions, which restrict wiring space and antenna functionality, and increasing layout area to enhance antennas complicates miniaturization.
Innovation Solution
An electronic package design with a carrier structure, multiple encapsulating layers, and antenna layers, where the thickness of the encapsulating layers is strategically controlled to optimize resonance and bandwidth, allowing for better antenna performance and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the substrate dimensions are fixed, then the manufacturing process is simplified, but the wiring space and antenna functionality are restricted
Solution Approach 1:
The patent transitions from a planar two-dimensional antenna layout to a three-dimensional stacked architecture. Multiple antenna layers (first antenna layer, second antenna layer) are positioned at different heights above the substrate, with encapsulating layers interleaved between them. This vertical stacking enables enhanced antenna functionality and signal processing capabilities without increasing the substrate footprint, effectively resolving the contradiction between fixed substrate dimensions and antenna performance requirements.
2Adaptability or versatility
If the layout area is increased to form antenna elements, then the antenna performance is improved, but the width of the module increases
Solution Approach 1:
The patent employs vertical stacking to achieve enhanced antenna performance without increasing the horizontal layout area. By positioning antenna elements at different heights (first antenna layer, second antenna layer separated by encapsulating layers), the design utilizes the third dimension (height) to provide additional antenna functionality while maintaining a compact module width suitable for portable devices.
Solution Approach 2:
The patent implements a nested structure where the first antenna layer is embedded within the encapsulating layer, which in turn is covered by the second antenna layer. This nested arrangement allows multiple antenna elements to be compactly integrated in a vertical configuration, maximizing antenna performance within a constrained horizontal footprint and preventing module width expansion.
3Adaptability or versatility
If multiple antenna layers are stacked vertically, then the antenna bandwidth is increased, but the device complexity increases
Solution Approach 1:
The encapsulating layers serve multiple functions simultaneously: they provide electrical insulation between antenna layers, mechanical support for the stacked structure, and electromagnetic shielding. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity despite the vertical stacking of multiple antenna layers for enhanced bandwidth.
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure with a circuit layer, a first encapsulating layer and a second encapsulating layer are formed on the carrier structure to cover the electronic element, a first antenna layer is formed on the first encapsulating layer, and a second antenna layer communicatively connected to the first antenna layer is formed on the second encapsulating layer. Therefore, the thickness of the first encapsulating layer is used to control the resonance distance of the antenna frequency so as to generate better resonance effect, and the distance between the first antenna layer and the second antenna layer is controlled by the thickness of the second encapsulating layer to increase the bandwidth of the antenna.