Stacked Antenna Package Structure for EMI Isolation
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating multiple antennas and semiconductor dies in a compact, high-performance package structure, particularly in preventing interference between antennas and ensuring reliable electrical connections.
Innovation Solution
A package structure is designed with a redistribution structure, through interlayer vias, and isolation layers, where semiconductor dies and antennas are stacked with specific encapsulation materials and metallization layers, allowing for independent operation and reduced interference between antennas, and improved electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are integrated in a compact package structure, then the device functionality and channel capacity are improved, but electromagnetic interference between antennas increases
Solution Approach 1:
The package structure is divided into multiple stacked layers with antennas positioned at different heights (first antenna in first layer, second antenna in second layer). This spatial segmentation separates the antennas in three-dimensional space, reducing electromagnetic interference while maintaining multiple antenna functionality for enhanced device capabilities and channel capacity.
Solution Approach 2:
The patent transitions from planar antenna arrangement to three-dimensional stacked configuration. By adding the vertical dimension (z-axis) with multiple layers separated by interlayer dielectric materials, the antennas are positioned at different heights, which reduces mutual interference while preserving all antenna functions for improved versatility.
2Volume of moving object
If multiple semiconductor dies and antennas are stacked in a compact structure, then the form factor and integration density are improved, but manufacturing complexity increases
Solution Approach 1:
The package structure employs a nested stacked configuration where semiconductor dies and antennas are arranged in multiple layers (first layer, second layer, third layer) with interlayer dielectric materials between them. This nesting approach achieves high integration density and compact form factor by utilizing vertical space, while the modular layer-by-layer construction helps manage manufacturing complexity through systematic assembly processes.
Solution Approach 2:
The patent utilizes three-dimensional stacking in the vertical dimension to achieve compact form factor. By arranging components in multiple layers along the z-axis rather than spreading them out in a plane, the integration density is significantly improved. The standardized layer structure with interlayer dielectrics provides a manageable manufacturing approach despite the increased three-dimensional complexity.
3Object-generated harmful factors
If isolation layers and shielding structures are added to prevent interference, then the electromagnetic compatibility is improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
Interlayer dielectric materials are introduced as intermediary substances between the first antenna and second antenna in adjacent layers. These dielectric layers act as electromagnetic isolators, reducing direct interference between antennas while maintaining a relatively simple overall structure. The intermediary dielectric materials provide electromagnetic compatibility without requiring complex active shielding mechanisms.
Solution Approach 2:
Isolation and shielding are applied locally at specific interfaces where antennas are positioned in adjacent layers, rather than implementing comprehensive shielding throughout the entire package. The interlayer dielectric materials are strategically placed between antenna-bearing layers to provide targeted electromagnetic isolation, improving compatibility while minimizing added complexity in non-critical areas.
Data Source
AI summary
A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.