Stacked Antenna Package Layout for Miniaturization Without Signal Loss
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Solution Overview
Problem
Existing antenna package structures are not satisfactory in terms of size reduction, which is necessary due to the trend of miniaturization in electronic products.
Innovation Solution
The proposed antenna package structure includes a substrate with an antenna tuner on the top surface and a communication device on the bottom surface, along with an antenna layer that vertically overlaps the antenna tuner, comprising a dielectric layer and an antenna element electrically coupled to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna package structure is reduced in size to meet miniaturization trends, then the device size is reduced, but the antenna performance and signal quality may deteriorate
Solution Approach 1:
The patent transitions from planar antenna layouts to a three-dimensional stacked configuration where the antenna element is positioned vertically above the substrate at a controlled distance. This vertical dimension allows the antenna to maintain adequate radiation space and performance characteristics while the overall package footprint is reduced, effectively resolving the contradiction between size reduction and performance maintenance
Solution Approach 2:
The antenna element is nested within the package structure by positioning it vertically above the substrate rather than extending laterally. This nesting approach allows the antenna to be contained within a compact volume while maintaining its functional characteristics, achieving miniaturization without sacrificing performance
2Volume of moving object
If the antenna element is positioned close to the substrate for size reduction, then the package size is reduced, but the signal loss and transfer losses increase
Solution Approach 1:
By moving the antenna element from a planar position close to the substrate to a vertical position at a controlled distance above the substrate, the patent reduces coupling losses and improves signal transfer efficiency while maintaining a compact package volume. The vertical separation minimizes energy loss through the substrate
Data Source
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AI summary
An antenna package structure includes a substrate, an antenna tuner, a communication device, and an antenna layer. The antenna tuner is disposed on a top surface of the substrate. The communication device is disposed on a bottom surface of the substrate. The antenna layer vertically overlaps the antenna tuner and includes a dielectric layer and an antenna element. The antenna element is disposed in the dielectric layer and is electrically coupled to the substrate.