Stacked Antenna Package Assembly for 100 GHz Planarity
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Solution Overview
Problem
The challenge of integrating high-frequency wireless communication devices with small antenna elements and active circuits is exacerbated by limited space, complex material selection, and manufacturing challenges such as non-planarity and high precision interconnects, which are not adequately addressed by existing packaging technologies.
Innovation Solution
The solution involves attaching components with secondary antennas to packages containing primary antennas using adhesive or solder, allowing for separate manufacturing and assembly of the top and bottom parts, which can include thick dielectric layers and fine resolution vias, thereby simplifying the manufacturing process and maintaining planarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna elements are increased in number for higher frequency wireless communication, then communication capability is improved, but area per antenna element reduces leading to insufficient space for active circuits and package overhead
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacking by placing the antenna element on one substrate and the active circuit on a separate substrate positioned above it, utilizing the vertical dimension to resolve space constraints at high frequencies
Solution Approach 2:
The patent divides the integrated circuit into separate components: the antenna element on a first substrate and the active circuit on a second substrate, allowing each to be optimized independently and connected via through-substrate conductors
2Adaptability or versatility
If fan-out routing is used to connect antenna elements to active circuits, then routing flexibility is improved, but routing length increases and manufacturing complexity worsens
Solution Approach 1:
The patent eliminates complex planar fan-out routing by establishing direct vertical connections through through-substrate conductors, reducing routing length and complexity while maintaining connectivity
3Reliability
If thick dielectric layers are used for antenna construction, then antenna performance is improved, but manufacturing precision and planarity deteriorate
Solution Approach 1:
The patent separates the thick dielectric antenna layer from the active circuit substrate, allowing the antenna substrate to be optimized for electromagnetic performance while the circuit substrate maintains manufacturing precision and planarity
Solution Approach 2:
The patent introduces a separate antenna substrate as an intermediary between the thick dielectric antenna structure and the active circuit, isolating the manufacturing challenges of thick layers from the precision requirements of circuit fabrication
4Reliability
If multiple layers are stacked to achieve sufficient total thickness, then antenna properties are improved, but package non-planarity and manufacturing complexity increase
Solution Approach 1:
The patent consolidates multiple thin layers into a single thick dielectric layer on the antenna substrate, achieving the required electromagnetic properties while maintaining planarity and simplifying manufacturing compared to stacking multiple layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-frequency operation around 100 GHz with improved yield and reliability by reducing warpage and complexity, allowing for simpler assembly and better antenna performance without the need for additional space-consuming solder balls.
Implementation Method 1
The at least one component is attached to the at least one package by adhesive
Data Source
AI summary
Devices and methods of manufacture of devices are disclosed. In an example, a device comprises at least one package and at least one component, wherein each package comprises at least one integrated circuit and at least one primary antenna and each component comprises at least one secondary antenna. The at least one component is attached to the at least one package by adhesive such that each secondary antenna is spaced from and stacked with one of the at least one primary antenna.