Stacked Antenna Package Layout for Compact Reconfigurable Tuning
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Solution Overview
Problem
Existing antenna package structures are inadequate in terms of size reduction, which is necessary due to the trend of miniaturization in electronic products.
Innovation Solution
The proposed antenna package structure includes a substrate with an antenna tuner on the top surface and a communication device on the bottom surface, featuring an antenna layer that vertically overlaps the antenna tuner and includes a dielectric layer and an antenna element, allowing for modification of antenna impedance, frequency, polarization, and radiation direction while reducing the overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna package structure is miniaturized to meet the trend of electronic product shrinkage, then the device size is reduced, but the antenna performance and integration capability may deteriorate
Solution Approach 1:
The patent transitions from planar antenna layout to three-dimensional stacked architecture, placing the antenna layer vertically above the substrate rather than laterally adjacent. This vertical dimensionality change enables miniaturization of the package footprint while preserving antenna radiation performance through maintained electrical characteristics.
Solution Approach 2:
The antenna layer is nested within the package structure above the substrate, with the dielectric layer containing antenna elements positioned vertically over the substrate surface. This nesting approach integrates the antenna within the package volume rather than requiring external mounting, achieving size reduction without performance compromise.
2Volume of moving object
If the antenna layer is positioned close to the substrate to reduce size, then the package volume is minimized, but electromagnetic interference between components may increase
Solution Approach 1:
A dielectric layer is introduced as an intermediary between the antenna elements and the substrate, providing electrical isolation and reducing electromagnetic coupling. This dielectric medium acts as a barrier that minimizes interference while allowing the antenna layer to be positioned close to the substrate for compact packaging.
Solution Approach 2:
The patent employs composite material structures including dielectric layers with specific permittivity properties to manage electromagnetic fields. The combination of different materials (conductive antenna elements, insulating dielectric layers, and substrate materials) creates a composite structure that simultaneously achieves miniaturization and electromagnetic interference reduction.
Data Source
AI summary
An antenna package structure includes a substrate, an antenna tuner, a communication device, and an antenna layer. The antenna tuner is disposed on a top surface of the substrate. The communication device is disposed on a bottom surface of the substrate. The antenna layer vertically overlaps the antenna tuner and includes a dielectric layer and an antenna element. The antenna element is disposed in the dielectric layer and is electrically coupled to the substrate.