3D Stacked Antenna Structure for Narrow Electronic Package Width
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Solution Overview
Problem
Traditional wireless communication modules with flat-type patch antennas face challenges in miniaturization due to size constraints and electromagnetic radiation limitations, requiring additional layout area for the antenna body, which hinders the reduction of the module's width.
Innovation Solution
A three-dimensional antenna structure is formed using a first metal layer and a second metal layer on opposing surfaces of a packaging layer, with defined leakage and reflective areas, creating a resonant cavity that allows propagating waves to pass through only the leakage areas, enabling constructive interference and forming a high-gain antenna, while allowing the antenna structure to correspond to the packaging layer's area, thus reducing the module's width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat-type patch antenna is used, then the antenna structure is simple and easy to manufacture, but the module width cannot be reduced due to additional layout area requirements
Solution Approach 1:
The patent transitions from a traditional planar antenna layout to a three-dimensional stacked configuration. The antenna body is positioned above the packaging substrate and electrically connected via a conductive structure, allowing the antenna to share the same footprint area as the packaging substrate without requiring additional lateral space. This vertical integration resolves the contradiction by maintaining manufacturing simplicity while eliminating the need for extra layout area, thereby reducing module width.
2Ease of manufacture
If the antenna body is integrally manufactured with electronic elements, then the packaging process is simplified, but electromagnetic radiation interference increases
Solution Approach 1:
The patent applies local quality by creating a differentiated structure where the antenna body is spatially separated from the electronic elements through vertical positioning, while maintaining electrical connection. The conductive structure serving as both support and electrical pathway is locally optimized to provide electromagnetic shielding. This allows the packaging process to remain integrated and simplified while the localized electromagnetic shielding properties prevent harmful radiation interference.
3Ease of operation
If additional layout area is provided for the antenna body, then the antenna can be properly positioned, but the packaging substrate width increases
Solution Approach 1:
The patent resolves the positioning issue by moving from a two-dimensional lateral arrangement to a three-dimensional vertical arrangement. The antenna body is positioned above the packaging substrate and connected through a conductive structure that extends vertically. This allows proper antenna positioning and electrical connection without requiring additional lateral layout area, thereby maintaining compact packaging substrate dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a narrower electronic package with a high-gain antenna, satisfying the demand for miniaturized designs by eliminating the need for additional layout area and optimizing the packaging process.
Implementation Method 1
the first metal layer and the second metal layer constitute an antenna structure... creating a resonant cavity that allows propagating waves to pass through only the leakage areas, enabling constructive interference and forming a high-gain antenna
Implementation Method 2
a first metal layer configured to carry a source for a propagating wave or provide emission or reflection of a propagating wave
Implementation Method 3
a leakage area and a reflective area are defined on the second surface of the packaging layer... allowing the propagating wave emitted by the first metal layer to directly pass therethrough
Implementation Method 4
enabling constructive interference and forming a high-gain antenna
Data Source
AI summary
An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.