Stacked Antenna Patch Coupling for Low-Reflection IC Integration

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Solution Overview

Problem

As wireless communication devices operate at higher frequencies such as millimeter wave, sub-Terahertz, and Terahertz regions, antenna integration within IC packages becomes necessary, but existing technologies face challenges with signal reflection losses due to mismatches between antenna substrates and IC components, leading to inefficiencies in output power and impedance matching.

Innovation Solution

The proposed antenna modules include an IC component with a first antenna patch on its face and a stack of antenna patches above it, where the second and further patches are electrically isolated from conductive pathways, reducing signal reflection by using capacitive coupling instead of physical connections, thus minimizing losses and enabling broad bandwidth operation with high return loss and gain.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If antenna patches are physically connected to IC components through conductive pathways, then electrical connection is achieved, but signal reflection losses increase due to impedance mismatch

Engineering Contradiction:

Improvesignal transmission qualityVSAvoidsignal reflection loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent replaces physical conductive pathways with capacitive coupling to connect antenna patches to IC components. This substitution eliminates the impedance mismatch inherent in traditional conductive connections, thereby reducing signal reflection losses while maintaining electrical connectivity for millimeter wave and higher frequency operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces capacitive coupling as an intermediary between antenna patches and IC components. This intermediary structure enables signal transmission while avoiding direct conductive connection, thus preventing the impedance mismatch that causes signal reflection and energy loss.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If antenna integration is implemented within IC packages for higher frequencies, then miniaturization is achieved, but impedance matching difficulties arise

Engineering Contradiction:

Improveantenna sizeVSAvoidimpedance matching

Core Design Contradiction:

Volume of moving objectVSEase of operation

Solution Approach 1:

The patent replaces traditional conductive interconnect structures with capacitive coupling mechanisms, enabling miniaturized antenna integration within IC packages while simultaneously solving impedance matching difficulties. The capacitive coupling provides inherent impedance transformation capability that simplifies matching in compact high-frequency designs.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If conventional antenna designs are used for millimeter wave frequencies, then basic functionality is achieved, but output power efficiency decreases

Engineering Contradiction:

Improvefrequency operation capabilityVSAvoidoutput power loss

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent replaces conventional conductive connection methods with capacitive coupling, enabling efficient millimeter wave and higher frequency operations. This substitution minimizes signal reflection and energy loss, thereby improving output power efficiency while maintaining broad frequency adaptability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the performance of antenna modules for millimeter wave, sub-THz, and THz operations by reducing signal reflection, improving impedance bandwidth, and radiation efficiency, while also offering low cost, high yield, ease of assembly, and mechanical handling advantages.

Implementation Method 1

the second and further patches are electrically isolated from conductive pathways, reducing signal reflection by using capacitive coupling instead of physical connections

Methodology Applied

Scientific EffectCapacitive coupling: Capacitance

Data Source

PatentUS20240405433A1Antenna modules and communication devices

Publication Date: 2024.12.05 INTEL CORP

AI summary

Disclosed herein are antenna modules, electronic assemblies, and communication devices. An example antenna module includes an IC component, an antenna patch support over a face of the IC component, and a stack of antenna patches vertically arranged at least partially above one another, where a first antenna patch of the stack is an antenna patch closest to the IC component, and a second antenna patch of the stack is an antenna patch closest to the first antenna patch. The first antenna patch is on the face of the IC component while the second and further antenna patches of the stack are on or in the antenna patch support and are electrically isolated from all electrically conductive material pathways in the antenna patch support and in the IC component.