Stacked Antenna Layers in Semiconductor Packages
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Solution Overview
Problem
As operating frequencies increase in wireless communication devices, the need for a wider resonant cavity between antennas to achieve frequency agility and improve bandwidth leads to increased package size, which exacerbates heat dissipation issues.
Innovation Solution
A semiconductor device package design featuring a first antenna layer on the backside surface of an electronic component, covered by a dielectric layer, with a second antenna layer spaced apart from the first by the dielectric layer, allowing for frequency agility and improved bandwidth while maintaining a compact size and effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the distance between antennas is increased to achieve frequency agility and improve bandwidth, then the resonant cavity performance is improved, but the package size increases and heat dissipation becomes severe
Solution Approach 1:
The patent transitions from a planar antenna arrangement to a three-dimensional stacked configuration. Multiple antenna layers are positioned at different heights above the substrate, utilizing the vertical dimension to achieve frequency agility without increasing the horizontal package footprint. This dimensional change allows resonant cavities to be formed in the Z-direction while maintaining a compact XY-plane layout.
Solution Approach 2:
The patent implements a nested structure where multiple antenna layers are stacked vertically, with each antenna layer and its associated ground layer forming a nested resonant cavity. The antennas are positioned within a compact package structure, effectively nesting the resonant cavities within each other in the vertical direction, thereby achieving frequency agility without proportionally increasing package volume.
2Adaptability or versatility
If the distance between antennas is increased to improve bandwidth, then the resonant cavity performance is improved, but heat dissipation becomes severe
Solution Approach 1:
By stacking antenna layers vertically, the patent creates resonant cavities in the Z-direction that improve bandwidth without expanding the horizontal area. This compact vertical arrangement reduces the overall package size, thereby improving heat dissipation efficiency compared to a planar layout that would require larger spacing.
Solution Approach 2:
The nested stacked configuration allows multiple resonant cavities to be formed within a compact volume. This nesting approach achieves the required bandwidth through vertical cavity structures while maintaining a small package footprint, which inherently improves heat dissipation by reducing the distance heat must travel to reach the package exterior.
3Volume of stationary object
If multiple antenna layers are stacked vertically, then frequency agility is achieved without increasing package size, but the manufacturing process becomes more complex
Solution Approach 1:
The patent divides the antenna system into multiple discrete layers, each consisting of an antenna pattern and a ground layer. These segmented layers are formed using sequential printing or deposition processes, allowing for modular manufacturing. The segmentation enables vertical stacking while maintaining manufacturing control through layer-by-layer fabrication.
Solution Approach 2:
The patent forms the antenna and ground layers in a predetermined stacked sequence during the manufacturing process. By pre-establishing the vertical arrangement of layers and their relative positions, the complex three-dimensional structure is created through systematic preliminary actions rather than requiring complex post-assembly operations.
Data Source
AI summary
The present disclosure provides a semiconductor device package. The semiconductor device package includes a first electronic component having an active surface and a backside surface opposite to the active surface and a first antenna layer disposed on the backside surface of the first electronic component. The semiconductor device package further includes a first dielectric layer covering the first antenna layer and a second antenna layer disposed over the first antenna layer. The second antenna layer is spaced apart from the first antenna layer by the first dielectric layer. A method of manufacturing a semiconductor device package is also disclosed.