Stacked Antenna Structure on Packaging Substrate for 5G Modules
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Solution Overview
Problem
The existing wireless communication modules face challenges in miniaturization and functionality due to the limitations of planar antenna structures, which restrict the integration with electronic components and hinder the implementation of 5G system requirements, leading to reduced yield and increased fabrication difficulties.
Innovation Solution
The proposed solution involves stacking antenna structures via conductive elements on a packaging structure with a carrier and circuit layer, allowing for independent fabrication of antenna and packaging structures, which enables increased circuit layout space and functionality, meeting the 5G system requirements while reducing production costs and time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar antenna structure is used, then the antenna can be manufactured with small size and light weight, but the integration with electronic components is difficult due to magnetic radiation characteristics and volume limitations
Solution Approach 1:
The patent transitions from a planar two-dimensional antenna structure to a three-dimensional stacked structure. The antenna structure is positioned above the substrate in the vertical dimension, allowing spatial separation from electronic components while maintaining electrical connection through conductive elements. This dimensional change resolves the integration difficulty by eliminating magnetic radiation interference between the antenna and components.
2Device complexity
If the substrate area is increased to accommodate the antenna body, then the antenna can be integrated with the substrate, but the width of the wireless communication module cannot be reduced
Solution Approach 1:
The antenna structure is moved from the horizontal plane to the vertical dimension, stacking above the substrate rather than expanding the substrate area. This allows the antenna body to be integrated with the substrate without increasing the module width, as the antenna occupies the vertical space above the substrate rather than horizontal space on the substrate surface.
3Adaptability or versatility
If more circuit layers are added onto the substrate to provide 5G electric functions, then the required electric functions can be achieved, but the yield factor of the substrate is reduced and fabrication difficulty increases
Solution Approach 1:
The patent separates the antenna structure from the substrate circuit layers, fabricating them as independent components. The antenna structure is manufactured separately and then stacked onto the substrate through conductive elements. This segmentation allows the substrate to maintain its original circuit layer configuration without adding excessive layers, thereby preserving yield factor and reducing fabrication difficulty while still achieving 5G electric functions.
Data Source
AI summary
An electronic package and a method for fabricating the same are provided. A plurality of electronic components are disposed in a packaging structure. At least one antenna structure is stacked via a plurality of conductive elements on the packaging structure. The antenna structure is electrically connected to at least one of the electronic components. The electronic components have different radio frequencies. In mass production, the antenna structures of different antenna types are stacked on the packaging structure, and a radio frequency product of various frequencies can be produced. Radio frequency chips of different frequencies need not be fabricated into a variety of individual packaging modules. Therefore, the production cost is reduced, and the production speed is increased.