Stacked Antenna Structure With Vacuum Resin Void Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing antenna devices face challenges in achieving stable and efficient radio wave radiation due to void formation in resin materials, leading to structural instability and power leakage from parallel plate modes, which affect antenna efficiency.
Innovation Solution
The antenna device incorporates a design with specific structural components including insulating and conductive layers, connecting conductive members, and resin members, which are arranged to minimize void formation and enhance capacitive coupling, thereby stabilizing the structure and reducing power leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If resin material is used to bond structures in antenna device, then structural stability is improved, but void formation occurs leading to power leakage and reduced reliability
Solution Approach 1:
The patent extracts and removes voids from the resin material through vacuum treatment during the stacking process. By applying vacuum pressure before curing, the voids formed between stacked antenna units are extracted and eliminated, preventing power leakage and improving antenna reliability while maintaining structural stability.
2Reliability
If multiple antenna units are stacked to improve antenna characteristics, then antenna performance is enhanced, but void formation and structural instability increase
Solution Approach 1:
The patent applies preliminary vacuum treatment before curing the resin material. By creating a vacuum state prior to resin curing, voids are removed in advance from the stacked antenna units, ensuring structural stability is maintained from the beginning while enabling enhanced antenna performance through multi-unit stacking.
Solution Approach 2:
The patent implements a nested stacking structure where multiple antenna units are vertically stacked and bonded using resin material. The vacuum treatment process penetrates through the nested structure to remove voids from between the stacked units, ensuring structural integrity while achieving improved antenna characteristics through the nested configuration.
3Strength
If resin material is applied between stacked structures, then bonding strength is improved, but void formation causes power leakage
Solution Approach 1:
The patent extracts voids from the resin material through vacuum treatment applied before curing. By removing voids in advance, power leakage is prevented while the resin material maintains its bonding strength function between stacked antenna units.
Solution Approach 2:
The vacuum treatment acts as an intermediary process between stacking and curing. It mediates the removal of voids from the resin material, ensuring that the resin provides both bonding strength and prevents power leakage by eliminating void formations during the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in improved antenna characteristics with higher reliability, mechanical strength, and reduced power leakage, achieving stable and efficient radio wave radiation.
Implementation Method 1
providing a first resin member between the first structure and the second structure, reducing a distance between the first structure and the second structure, causing a part of the first resin member to move into a first space in the first cylindrical portion
Data Source
AI summary
According to one embodiment, an antenna device includes a first structure, a second structure, a third structure, a signal line, a first resin member, and a first intermediate member. The first structure includes a first insulating member, a first conductive layer, and a first connecting conductive member that pierces the first insulating member along a first direction and includes a first cylindrical portion along the first direction. The second structure includes a second insulating member, a second conductive layer, and a second connecting conductive member that pierces the second insulating member along the first direction. The signal line is provided between the second insulating member and the first insulating member. The third structure includes a third insulating member and a third conductive layer. The first intermediate member is provided between the first structure and the third structure, and in contact with the first structure and the third structure.