Low-Profile Stacked Antenna Structure for Wider Bandwidth

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The challenge is to expand the bandwidth of low-profile antenna structures while ensuring they can be packaged in a circuit board with limited thickness, as smaller profiles typically result in narrower bandwidths.

Innovation Solution

The antenna structure includes a signal reference ground, a first radiation patch, a second radiation patch, and at least one feed probe, where the feed probe feeds both radiation patches in a coupled manner, with specific positioning and length to achieve dual resonances and improved impedance matching, allowing for a low profile and increased bandwidth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the antenna structure is designed with a smaller profile to be packaged in a thin circuit board, then the device size is reduced, but the bandwidth becomes narrower

Engineering Contradiction:
Improveprofile thicknessVSAvoidbandwidth
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a conventional planar antenna layout to a three-dimensional stacked configuration with multiple radiation patches arranged in vertical layers. This dimensional change allows the antenna to achieve larger effective radiating area and broader bandwidth while maintaining a thin overall profile suitable for circuit board packaging.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines multiple radiation patches (first and second radiation patches) into a single integrated antenna structure fed by one feed probe. This merging of multiple radiating elements creates coupled resonances that expand the bandwidth while keeping the structure compact and low-profile.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of moving object

If the antenna structure is designed with a smaller profile, then it can be packaged in a thin circuit board, but the impedance matching performance deteriorates

Engineering Contradiction:
Improveprofile thicknessVSAvoidimpedance matching
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The feed probe extends vertically through multiple dielectric layers to reach both radiation patches in different planes, creating optimized coupling paths. This three-dimensional feeding arrangement enables precise impedance control and dual resonance excitation despite the thin overall profile.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple dielectric layers with specific permittivity values are introduced as intermediary materials between the feed probe and radiation patches, and between radiation patches. These intermediary layers provide precise control over electromagnetic field distribution, enabling optimal impedance matching and resonance coupling.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables the antenna structure to be packaged in a circuit board while maintaining a large bandwidth and low profile, with enhanced impedance matching and dual polarization capabilities, reducing cross-interference and increasing transmission and reception capacities.

Implementation Method 1

A part that is of each feed probe and that is face-to-face with the first radiation patch is capable of feeding the first radiation patch and the second radiation patch in a coupled feeding manner

Methodology Applied
Scientific EffectCoupled feeding:

Implementation Method 2

When one feed probe performs feeding, the two radiation patches generate two resonances

Methodology Applied
Scientific EffectResonance: Resonance

Implementation Method 3

a first dielectric layer, a second dielectric layer, and a third dielectric layer that are sequentially stacked

Methodology Applied
Scientific EffectDielectric transmission: Dielectric

Data Source

PatentEP4050728B1Antenna structure, circuit board having antenna structure, and communication device
Publication Date: 2025.08.27 HUAWEI TECH CO LTD
  • EP4050728B1 patent drawingFigure 1~3
  • EP4050728B1 patent drawingFigure 4~5
  • EP4050728B1 patent drawingFigure 6~7

AI summary

Embodiments of this application provide an antenna structure, a circuit board with an antenna structure, and a communications device, and relate to the field of communications device technologies, to lower a profile of the antenna structure while meeting a bandwidth of the antenna structure, so that the antenna structure can be packaged in a circuit board in the communications device. The antenna structure includes a signal reference ground, a first radiation patch, a second radiation patch, and at least one feed probe. The at least one feed probe is located between the first radiation patch and the signal reference ground. Each feed probe includes a first end and a second end that are opposite to each other. A projection position of the first end on a plane on which the signal reference ground is located is outside a projection area of the first radiation patch on the plane on which the signal reference ground is located, and a projection position of the second end on the plane on which the signal reference ground is located is inside the projection area of the first radiation patch on the plane on which the signal reference ground is located. The second end is electrically connected to the signal reference ground. The antenna structure provided in embodiments of this application is applied to a terminal.