Stacked Antenna Structure for Miniaturized Electronic Package

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Solution Overview

Problem

Traditional wireless communication modules face challenges in miniaturization due to the need for additional layout area for conductive traces in patch antennas, limiting the reduction of module width.

Innovation Solution

The implementation of a stacked antenna structure using spacing members and wires connected by wire bonding, eliminating the need for extra surface area on the carrier, allowing for a narrower carrier width and enabling miniaturization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a patch antenna with conductive trace is used, then the antenna can be integrated with the carrier, but an additional layout area is needed on the surface of the carrier, preventing miniaturization

Engineering Contradiction:

Improveantenna integrationVSAvoidcarrier width

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions the antenna structure from a two-dimensional planar layout to a three-dimensional stacked configuration. The conductive trace is formed vertically through the carrier using via holes rather than horizontally on the surface, allowing the antenna to be integrated within the carrier's volume rather than requiring additional surface area. This dimensional change enables miniaturization while maintaining antenna functionality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the carrier width is reduced for miniaturization, then the electronic package size is reduced, but the antenna structure cannot be properly formed without additional layout area

Engineering Contradiction:

Improvecarrier widthVSAvoidantenna formation

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The antenna structure is segmented into multiple vertical components: a first conductive trace layer on the first surface, via holes penetrating through the carrier, and a second conductive trace layer on the second surface. This segmentation allows the antenna to be formed within the carrier's thickness rather than requiring extended surface area, enabling both miniaturization and manufacturability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The antenna structure is nested within the carrier's three-dimensional volume. The conductive traces and via holes are embedded within the carrier substrate, utilizing the carrier's internal space rather than requiring additional external layout area. This nesting approach enables the antenna to be integrated without increasing the carrier's footprint.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS10074621B2Electronic package with antenna structure

Publication Date: 2018.09.11 SILICONWARE PRECISION IND CO LTD

AI summary

Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.