Stacked Array Antenna Module With Integrated Heat Sinks

The patent transitions from conventional planar heat dissipation to a three-dimensional stacked architecture where multiple antenna arrays are arranged in layers. Heat sinks are integrated between substrates in the vertical dimension, enabling heat dissipation pathways that do not interfere with the planar antenna radiation patterns. This dimensional transition allows simultaneous achievement of extended communication range through multiple amplifiers and effective heat management.

The patent implements nesting by placing heat sinks within the stacked structure between substrates, and integrating amplifiers on substrate surfaces. The heat sinks are nested within the overall antenna module architecture, utilizing the vertical space between radiation elements. This nested arrangement allows heat dissipation components to be incorporated without increasing the planar footprint, thereby maintaining compact form factor while managing heat from high-power amplifiers.

By stacking antenna arrays in the vertical dimension, the patent reduces the planar pitch between antenna elements while distributing heat generation across multiple layers. Heat sinks are positioned between substrates to provide thermal management for each stacked layer independently, preventing heat accumulation that would result from reduced pitch arrangements.

The patent divides the antenna system into multiple independent stacked layers, each with its own amplifiers and heat sinks. This segmentation allows heat to be dissipated locally at each layer rather than accumulating in a single dense structure. The modular stacked architecture enables reduced pitch while maintaining heat dissipation efficiency through distributed thermal management.