Stacked Audio Amplifier Layout for Ground Loop Noise Reduction
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Solution Overview
Problem
Conventional twin-monaural amplifying devices experience a reduction in Signal to Noise (S/N) ratio due to the formation of ground loops caused by magnetic fields interacting with grounded and signal lines, leading to noise interference in audio signals.
Innovation Solution
The amplifying device employs a configuration where two substrates, each with corresponding ground and signal lines, overlap in planar view to minimize the area of the ground loop, ensuring that the ground lines and signal lines correspond in position and shape, thereby reducing noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional twin-monaural construction with separate substrates is used, then audio signal amplification is achieved, but ground loop noise reduces S/N ratio
Solution Approach 1:
The patent transitions from a planar substrate layout to a three-dimensional stacked substrate configuration. By placing substrates in multiple layers with corresponding ground and signal lines overlapping vertically, the ground loop area is minimized while maintaining functional separation of audio channels.
Solution Approach 2:
The patent merges the ground lines of both audio channels by making them overlap and connect at multiple points, effectively combining them into a single shared ground path. This eliminates the separate ground loops that cause noise interference.
2Reliability
If ground lines are extended to connect audio input/output terminals, then electrical connectivity is achieved, but ground loop area increases causing noise
Solution Approach 1:
The patent uses vertical stacking to route ground lines through multiple substrate layers, allowing ground connectivity without expanding the horizontal footprint. Corresponding ground lines on different substrates overlap vertically, maintaining electrical connectivity while minimizing the planar area enclosed by ground loops.
3Object-affected harmful factors
If magnetic shielding is added to reduce ground loop noise, then noise reduction is achieved, but device complexity increases
Solution Approach 1:
The patent extracts and eliminates the source of the problem by reconfiguring the ground line arrangement to prevent ground loop formation in the first place, rather than adding shielding to counteract the noise. This removes the need for additional magnetic shielding components.
Solution Approach 2:
The patent converts the potential harm of extended ground lines into a benefit by using the same ground lines that connect input/output terminals also serving as the noise-reduction mechanism. The ground lines themselves become the solution when configured in overlapping vertical paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise caused by ground loops, improving the S/N ratio and minimizing the area surrounded by the ground loop, resulting in enhanced audio signal quality.
Implementation Method 1
In the event that a magnetic field is generated near the ground loop formed by the grounded lines and the signal lines, the magnetic field produces a current in the grounded loop.
Data Source
AI summary
An amplifying device includes first and second substrates. The first substrate has a first mounting surface, and the second substrate has a second mounting surface. The first mounting surface of the first substrate that is opposite the second substrate is provided with: a first ground line; a first signal line configured to transfer an audio signal; and a first amplifier configured to amplify the audio signal. The second mounting surface of the second substrate that is opposite the first substrate is provided with: a second grounded line; a second signal line configured to transfer an audio signal; and a second amplifier configured to amplify the audio signal. The first and second grounded lines correspond to each other in position and shape, and overlap in planar view. The first and second signal lines correspond to each other in position and shape, and overlap in planar view.