Stacked Semiconductor Backside Contacts for Dual-Side Power Routing
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Solution Overview
Problem
Conventional semiconductor structures restrict the ability for both devices in a stacked configuration to connect to backside power lines, limiting the design flexibility and resource allocation for frontside wiring.
Innovation Solution
The semiconductor structure is formed with a stacked configuration where both devices are connected to backside power lines via backside contacts, allowing for a wider top device with staggered or narrow frontside connections, enabling power supply from both sides and optimizing wiring resources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If both devices in a stacked configuration connect to backside power lines, then power distribution efficiency is improved and frontside wiring resources are optimized, but conventional structures restrict this ability limiting design flexibility
Solution Approach 1:
The patent implements backside contacts and backside power lines to provide power distribution from the opposite side of conventional frontside wiring. This dimensional change enables both stacked devices to receive power independently, improving power distribution efficiency while optimizing frontside wiring resources for other functions.
2Adaptability or versatility
If a wider top device is implemented with staggered or narrow frontside connections, then device functionality is improved, but conventional structures limit the ability to achieve this configuration
Solution Approach 1:
The patent divides the power distribution function into two independent paths: frontside power lines for the first device and backside power lines for the second device. This segmentation allows each device to have optimized wiring independently, enabling wider top devices with staggered or narrow frontside connections without increasing overall system complexity.
Data Source
AI summary
A semiconductor structure includes a stacked device structure containing a first device and a second device over the first device in a stacked configuration. The semiconductor structure further includes a first backside contact connected to the first device and a first backside power line. The semiconductor structure further includes a second backside contact connected to the second device and a second backside power line.