Stacked Battery Backup for Volatile Memory Power Retention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Computing systems with volatile memory face data loss and increased latency when power is interrupted, requiring time-consuming reloading of data upon power restoration.
Innovation Solution
Integration of a battery module with a die-stacking package that includes a battery charger, temperature sensor, and control logic to supply power to volatile memory during main power supply failures, preventing data loss and reducing recovery time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a battery module is integrated with the die-stacking package to supply power during main power supply failures, then data loss is prevented and system recovery time is reduced, but device complexity increases
Solution Approach 1:
The battery module is physically integrated with the die-stacking package, combining backup power functionality with the existing memory and logic die structure. This merging approach enables seamless power transition during main power supply failures while maintaining a compact form factor.
Solution Approach 2:
The battery module serves multiple functions: it acts as a backup power source during main power failures, provides power stabilization, and enables rapid system recovery. This multi-functionality justifies the added complexity by delivering multiple benefits from a single integrated component.
2Stability of the object's composition
If control logic and temperature sensors are added to manage power supply and prevent overheating, then system stability and safety are improved, but device complexity increases
Solution Approach 1:
Temperature sensors continuously monitor the thermal state of the battery module and die-stacking package, providing feedback to the control logic. This feedback mechanism enables dynamic adjustment of power supply and cooling strategies, ensuring system stability while preventing overheating.
Solution Approach 2:
The control logic is designed to anticipate potential power failures or thermal issues and takes preliminary actions to prevent them. For example, it can pre-charging the battery module before main power failure occurs or activate cooling mechanisms before critical temperature thresholds are reached.
3Reliability
If the battery module is disposed on the FPGA die to provide localized power, then power stability for volatile memory is improved, but manufacturing complexity increases
Solution Approach 1:
The power supply system is segmented into localized battery modules positioned on individual FPGA dies or memory dies, rather than using a centralized power source. This segmentation allows each die to have dedicated backup power, improving power stability while enabling modular manufacturing approaches.
Solution Approach 2:
The battery module is positioned in a three-dimensional stacked configuration above the FPGA die, utilizing the vertical dimension rather than only planar placement. This 3D integration approach reduces the footprint on the die surface while maintaining close proximity for efficient power delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Faster system recovery (up to 100 times faster) with reduced energy consumption and improved power stability, while preventing data loss and isolating noisy power elements.
Implementation Method 1
a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state
Implementation Method 2
temperature sensor, and control logic to supply power to volatile memory during main power supply failures
Data Source
AI summary
A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.