Stacked Circuit Board Cooling With 3D Heat Dissipation Paths
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Solution Overview
Problem
The increasing heat flux density due to a larger quantity of functional components on stacked circuit boards in electronic devices leads to inadequate heat dissipation and reduced reliability.
Innovation Solution
A heat dissipation apparatus with a three-dimensional heat dissipation topology network formed by thermal conductive layers and structures between circuit boards, utilizing a support post to create an air layer and thermal conductive assemblies to efficiently transfer heat from a main heat generation component to a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a larger quantity of functional components are mounted on stacked circuit boards to improve component integration, then component integration is improved, but heat flux density increases and heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from traditional planar heat dissipation to three-dimensional heat dissipation by stacking multiple circuit boards vertically. The heat dissipation apparatus includes a first circuit board and a second circuit board arranged in a stacked manner, with thermal conductive assemblies connecting them to form a three-dimensional heat dissipation topology network. This spatial arrangement allows heat to be dissipated through multiple dimensions simultaneously, resolving the contradiction between component integration and heat dissipation capability.
Solution Approach 2:
The patent divides the heat dissipation system into multiple independent thermal conductive paths by segmenting the circuit boards into stacked layers. Each circuit board has its own thermal conductive layers and structures, connected through thermal conductive assemblies. This segmentation creates multiple parallel heat dissipation channels, allowing heat from numerous functional components to be distributed and dissipated efficiently across the stacked structure, thereby maintaining reliability while improving component integration.
2Reliability
If multiple thermal conductive layers and structures are used to form a three-dimensional heat dissipation topology network, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges thermal conduction and structural support functions into integrated components. The thermal conductive assemblies serve both as heat transfer pathways and as structural elements that maintain the stacked configuration of circuit boards. Additionally, the support posts simultaneously provide mechanical support and create air layers for natural convection heat dissipation. This merging reduces the need for separate components, thereby improving heat dissipation efficiency while controlling device complexity.
3Reliability
If thermal conductive assemblies are used to connect thermal conductive layers between circuit boards, then heat transfer capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent introduces thermal conductive assemblies as intermediary components that facilitate heat transfer between the first and second circuit boards. These assemblies include thermal conductive blocks and thermal conductive pastes that act as mediators to bridge the thermal gap between stacked circuit boards. By using standardized intermediary components with well-defined thermal properties, the patent achieves high heat transfer capability while maintaining relatively simple manufacturing processes through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces junction temperature, improves heat dissipation efficiency, and enhances the working reliability and service life of the main heat generation component.
Implementation Method 1
The thermal conductive assembly is connected between the first thermal conductive layer of the second circuit board and the second thermal conductive layer
Implementation Method 2
The support post is connected between the first circuit board and the second circuit board, to form an air layer between the first circuit board and the second circuit board
Implementation Method 3
the first thermal conductive layer is configured to connect to a heat sink
Data Source
AI summary
A heat dissipation apparatus is connected to a heat sink. The heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board, to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.