Stacked Circuit Board Assembly for Compact Component Integration
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Solution Overview
Problem
As electronic devices become increasingly compact and multifunctional, there is a need for improved circuit board assemblies that can efficiently integrate electrical components while maintaining electrical connectivity and structural integrity.
Innovation Solution
A circuit board assembly design featuring a first substrate with first pads, a first layer with accommodating portions, an electrical component with second pads, a second layer with corresponding receiving portions, and a conductive member to connect the pads, secured by a bonding resin, allowing for stacked and aligned components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic devices are downsized to be conveniently carried by users, then portability is improved, but space for integrating electrical components is reduced
Solution Approach 1:
The patent transitions from planar component arrangement to three-dimensional stacked configuration. Multiple circuit boards are vertically stacked with conductive members extending through holes in alternating boards to create electrical connections across layers, effectively utilizing vertical space to integrate multiple components in a compact footprint
Solution Approach 2:
The patent implements a nested structure where conductive members are embedded within holes that penetrate through multiple circuit boards. The bonding resin is injected into receiving portions formed between stacked boards, creating a nested arrangement where components and connection elements are contained within the spaces between layers
2Adaptability or versatility
If multiple electrical components are integrated into a compact space, then device functionality is improved, but maintaining electrical connectivity becomes more difficult
Solution Approach 1:
Holes are pre-formed through the circuit boards before stacking, and conductive members are positioned within these pre-prepared holes. The bonding resin is also positioned in advance in receiving portions, ensuring that all electrical connections and structural bonds are pre-configured before final assembly, thereby maintaining reliable connectivity in the compact integrated structure
Solution Approach 2:
The conductive members serve as intermediary elements that bridge electrical connections between separate circuit boards. These conductive members extend through holes in alternating boards, acting as mediators that maintain reliable electrical connectivity across the stacked configuration without requiring direct contact between components
3Volume of moving object
If components are stacked to reduce device size, then portability is improved, but structural stability becomes more challenging to maintain
Solution Approach 1:
The patent merges multiple circuit boards into a single integrated assembly through vertical stacking. Conductive members and bonding resin are combined to create both electrical connections and structural bonds simultaneously, forming a unified structure that maintains stability while achieving compact integration
Solution Approach 2:
The patent employs composite construction combining circuit boards, conductive members, and bonding resin in a multi-layer stack. The bonding resin acts as a structural adhesive that bonds the stacked boards together, creating a composite structure that maintains structural integrity despite the compact stacked configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances electrical connectivity and structural stability in compact electronic devices, facilitating the integration of multiple functions without compromising performance or size.
Implementation Method 1
a conductive member configured to electrically connect the at least one first pad and the at least one second pad
Implementation Method 2
a first bonding resin disposed in the at least one first receiving portion and the at least one second receiving portion
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a first substrate disposed inside the housing and including at least one first pad, a first layer disposed on the first substrate and including at least one first accommodating portion, an electrical component disposed inside the housing and including at least one second pad positioned corresponding to the at least one first pad, a second layer disposed on the electrical component, stacked on the first layer, and including at least one second accommodating portion, a conductive member configured to electrically connect the at least one first pad and the at least one second pad, and first bonding resin disposed in the at least one first receiving portion and the at least one second receiving portion.