Stacked Circuit Board Module for Stable High-Current Power Delivery
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Solution Overview
Problem
Existing circuit board configurations face challenges in achieving voltage stabilization and efficient large current supply for low-voltage, high-current semiconductor processors, leading to inefficiencies in power delivery.
Innovation Solution
A circuit board module design featuring a first circuit board with a power semiconductor device and a second circuit board with a power conversion circuit, where positive and negative output pins project from the first circuit board and extend through vias to directly connect with the load on the second circuit board, reducing current loss and stabilizing voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional circuit board configuration is used with circuit elements mounted on the mounting surface, then the structure is simple, but voltage stabilization and large current supply efficiency are insufficient
Solution Approach 1:
The circuit board is divided into two separate circuit boards: a first circuit board for mounting the power conversion circuit and a second circuit board for mounting the load. This segmentation allows independent optimization of each board's function, improving voltage stabilization while maintaining structural simplicity through functional separation.
Solution Approach 2:
The patent transitions from a single-plane mounting configuration to a multi-layer stacked configuration. The power conversion circuit and load are mounted on different circuit boards that are stacked and electrically connected, utilizing the vertical dimension to reduce current path length and improve electrical performance without increasing planar complexity.
2Productivity
If circuit patterns on the circuit board are used to supply current, then the manufacturing is simple, but current supply efficiency and voltage stabilization are poor
Solution Approach 1:
The patent extracts the power supply interface from the conventional circuit board structure by using separate output pins on the first circuit board that directly connect to the load on the second circuit board. This extraction creates a dedicated, low-impedance current path that improves supply efficiency while maintaining ease of manufacture through standardized pin and via connections.
Solution Approach 2:
The output pins and through vias serve as intermediaries that directly connect the power conversion circuit to the load, bypassing the conventional circuit board traces. This intermediary connection path has lower resistance and inductance, improving current supply efficiency while being manufacturable using standard PCB through-hole technology.
3Temperature
If heat-dissipation fins are used, then heat dissipation is improved, but the device complexity and cost increase
Solution Approach 1:
The circuit board structure itself serves the heat dissipation function through its multi-layer configuration and direct electrical connections. The stacked circuit board design with direct pin-to-via connections provides inherent thermal pathways that dissipate heat without requiring additional heat-dissipation fins, maintaining simplicity while improving temperature management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances voltage stabilization and current efficiency, allowing for a simple and cost-effective power supply interface, particularly suitable for semiconductor processors with multiple communication ports, while also improving heat dissipation without the need for heat-dissipation fins.
Implementation Method 1
The positive output pin is inserted through the positive through via in such a manner as to reach the fourth main surface. The negative output pin is inserted through the negative through via in such a manner as to reach the fourth main surface. The load receives a current supplied from the power conversion circuit through the positive output pin and the negative output pin.
Implementation Method 2
The second main surface of the first circuit board and the third main surface of the second circuit board are physically in close contact with each other.
Data Source
AI summary
A first circuit board includes a positive output pin and a negative output pin of a power conversion circuit, each of which has a shape projecting from a second main surface. A second circuit board has a positive through via and a negative through via, each of which has a shape extending between a third main surface and a fourth main surface. The second main surface of the first circuit board and the third main surface of the second circuit board are physically in close contact with each other. The positive output pin is inserted through the positive through via to reach the fourth main surface. The negative output pin is inserted through the negative through via in such a manner as to reach the fourth main surface. The load receives a current supplied from the power conversion circuit through the positive output pin and the negative output pin.