Stacked Circuit Board Power Module Layout for Stable Chip Voltage
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Solution Overview
Problem
The existing power supply solutions for high computing power chips face issues of current imbalance, long power supply links leading to high impedance and inductance, resulting in voltage fluctuations and reduced computing performance.
Innovation Solution
A circuit board assembly design with substrates on opposite sides and integrated power modules that vertically supply power, utilizing elastic conductive members and support structures to ensure reliable electrical connections and reduce link length, impedance, and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the power supply link is made long to accommodate chip placement, then the chip can be positioned on the circuit board, but the impedance and inductance of the power supply link increase
Solution Approach 1:
The patent transitions from a planar power supply layout to a three-dimensional stacked architecture. The power supply module is positioned on a first substrate while the chip is mounted on a second substrate, with power delivered vertically through the substrate stack. This dimensional change dramatically shortens the power supply path length, reducing impedance and inductance while maintaining placement flexibility.
2Object-affected harmful factors
If the power supply link length is reduced to lower impedance and inductance, then voltage fluctuation is reduced, but the layout flexibility for chip and power module placement is constrained
Solution Approach 1:
The patent divides the circuit board into multiple stacked substrates, separating the power supply module and chip onto different layers. This segmentation allows independent optimization of each module's position while maintaining short interconnection paths through vertical connections, thus reducing voltage fluctuation without sacrificing overall layout flexibility.
Solution Approach 2:
By moving from a two-dimensional planar layout to a three-dimensional stacked configuration, the patent enables short power supply paths through the vertical dimension. This allows flexible horizontal placement of modules on different substrates while maintaining minimal power link lengths through direct vertical connections.
3Ease of manufacture
If conventional planar power supply layout is used, then manufacturing is simpler, but current imbalance and voltage fluctuation occur
Solution Approach 1:
The patent employs a three-dimensional stacked power supply architecture where power modules on one substrate connect vertically to chips on another substrate. This vertical power delivery path equalizes current distribution and minimizes voltage fluctuation, improving reliability while using standard manufacturing processes for multi-layer circuits.
Data Source
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AI summary
This application discloses a circuit board assembly and an electronic device. The circuit board assembly includes a first substrate, a second substrate, a chip, and a first power module. The first substrate and the second substrate are disposed opposite to each other and at an interval. A power supply component and a conductive member are disposed on a first surface that is of the first substrate and that faces the second substrate, and the power supply component is electrically connected to the conductive member. The chip is disposed on a first surface that is of the second substrate and that faces away from the first substrate, and the first power module is disposed on a second surface that is of the second substrate and that faces the first substrate. An input terminal is disposed on a surface that is of the first power module and that faces the first substrate, and the input terminal is electrically connected to the conductive member. An output terminal is disposed on a first surface that is of the first power module and that faces the second substrate, and the output terminal is electrically connected to the chip. The first power module is configured to perform regulating and filtering on a voltage input by the input terminal, and then output a voltage to the output terminal.