Stacked Semiconductor Bonding Pads for Misalignment-Tolerant Daisy Chains
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in effectively connecting multiple semiconductor structures in a vertical stack while ensuring electrical connectivity and addressing misalignment issues during bonding, which can lead to defective devices.
Innovation Solution
A semiconductor device design featuring a daisy chain connection through conductive patterns, plugs, and bonding pads, with hybrid-bonding structures using metal-to-metal and insulator-to-insulator bonding, and a configuration of sub-bonding pads to ensure electrical connectivity even with misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor structures are stacked vertically to increase capacity, then data processing capability is improved, but alignment precision deteriorates due to cumulative bonding errors
Solution Approach 1:
The bonding pad is divided into multiple sub-bonding pads (first sub-bonding pads and second sub-bonding pads) that are separated from each other. This segmentation allows individual sub-pads to tolerate misalignment independently, preventing a single bonding error from affecting the entire connection. The segmented structure enables successful bonding even when cumulative alignment errors occur during vertical stacking of multiple semiconductor structures.
Solution Approach 2:
Different regions of the bonding interface have different functions: some sub-bonding pads are designed for electrical connection while others provide mechanical support or alignment tolerance. The local quality variation allows certain areas to compensate for misalignment while maintaining electrical connectivity in critical regions, thereby improving overall bonding robustness in multi-structure stacks.
2Reliability
If bonding pads are made larger to ensure connectivity, then electrical connection reliability is improved, but device area increases
Solution Approach 1:
Instead of using a single large bonding pad, the design employs multiple smaller sub-bonding pads distributed across the bonding interface. This segmentation achieves reliable electrical connection through multiple contact points while keeping the total area occupied by individual pads smaller, thus maintaining device compactness without sacrificing connection reliability.
Solution Approach 2:
The bonding connection is distributed across multiple spatial dimensions rather than concentrated in a single large pad. By arranging sub-bonding pads in a distributed pattern, the design achieves robust electrical connectivity through spatial distribution, effectively reducing the footprint while maintaining or enhancing connection reliability.
3Reliability
If hybrid bonding (metal-to-metal and insulator-to-insulator) is used to enhance connectivity, then electrical connection strength is improved, but manufacturing complexity increases
Solution Approach 1:
The hybrid bonding approach is applied selectively to specific sub-bonding pads rather than uniformly across the entire bonding interface. This segmented application allows the system to achieve enhanced electrical connection strength in critical areas while avoiding the full manufacturing complexity of hybrid bonding everywhere, thus balancing performance and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable electrical connection between stacked semiconductor structures, verifying connectivity through a daisy chain and through electrodes, and mitigates defects due to misalignment, enhancing device performance.
Implementation Method 1
hybrid-bonding structures using metal-to-metal and insulator-to-insulator bonding
Implementation Method 2
hybrid-bonding structures using metal-to-metal and insulator-to-insulator bonding
Implementation Method 3
a plurality of second conductive patterns, the one or more second conductive plugs, the second bonding pad, the first bonding pad, the plurality of first conductive plugs, and the one or more first conductive patterns form a daisy chain
Data Source
AI summary
A semiconductor device includes: a first semiconductor structure including a first semiconductor substrate, one or more first conductive patterns, a plurality of first conductive plugs, and a first bonding pad; a second semiconductor structure including a second semiconductor substrate, a plurality of second conductive patterns, one or more second conductive plugs, and a second bonding pad; and two through electrodes penetrating the second semiconductor substrate and respectively connected to two second conductive patterns positioned at opposite ends of the plurality of second conductive patterns, wherein the second bonding pad is bonded to the first bonding pad so that the plurality of second conductive patterns, the one or more second conductive plugs, the second bonding pad, the first bonding pad, the plurality of first conductive plugs, and the one or more first conductive patterns form a daisy chain.