Stacked Bus Bar Layout for Low-Inductance Semiconductor Modules
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Solution Overview
Problem
Conventional semiconductor modules experience increased inductance at input terminals due to the spacing of conductor rods, leading to potential power loss and noise issues, as laminated wiring is disrupted.
Innovation Solution
A semiconductor module design featuring a bus bar with overlapping supply terminals and input terminals, where the second supply terminal is spaced apart and overlaps with the first supply terminal in the thickness direction, ensuring continuous laminated wiring and reduced inductance, and includes an insulating member and insulator to maintain electrical insulation and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor rods are spaced apart in the short side direction to connect input terminals, then the semiconductor device can be electrically connected to power sources, but inductance increases and laminated wiring is disrupted
Solution Approach 1:
The patent transitions from planar arrangement of conductor rods to a three-dimensional stacked configuration where conductor rods are arranged in multiple layers vertically. This dimensional change allows input terminals to be connected while maintaining laminated wiring structure, as conductors in different layers can overlap in the planar view but are separated in the vertical dimension, thus reducing inductance while ensuring electrical connection reliability
Solution Approach 2:
The patent implements a nested structure where conductor rods are positioned within stacked layers of the bus bar assembly. The conductor rods are embedded in insulating material and arranged in a nested configuration across multiple layers, allowing the laminated wiring structure to continue through the vertical dimension while providing reliable electrical connections at the input terminals
2Object-affected harmful factors
If laminated wiring is implemented in the conductor assembly, then inductance is reduced and noise is suppressed, but the wiring structure becomes complex
Solution Approach 1:
The patent merges the function of multiple conductor rods and insulating structures into an integrated bus bar assembly. The laminated wiring structure combines positive and negative conductor rods with insulating material in a unified stacked configuration, achieving noise suppression through inductance reduction while simplifying the overall structure by integrating multiple components into a single modular assembly that can be treated as one functional unit
3Reliability
If input terminals are spaced apart in the thickness direction, then electrical insulation is improved, but inductance increases at the terminal region
Solution Approach 1:
The patent resolves the inductance issue at spaced input terminals by introducing vertical stacking of conductor rods in multiple layers. The conductor rods are positioned at different heights in the thickness direction but overlap in the planar projection, maintaining the insulating spacing between terminals while preserving the laminated wiring configuration that reduces inductance. This dimensional arrangement allows both electrical insulation and low inductance to coexist
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces inductance and suppresses noise, leading to stable power supply and reduced power loss by maintaining continuous laminated wiring and electrical insulation between the bus bar and input terminals.
Implementation Method 1
laminated wiring is realized in the rod-shaped conductor assembly. Thus, inductance is reduced by magnetic fields that are generated at one pair of conductor rods
Data Source
AI summary
A semiconductor module includes a semiconductor device and bus bar. The device includes an insulating substrate, conductive member, switching elements, and first/second input terminals. The substrate has main/back surfaces opposite in a thickness direction, with the conductive member disposed on the main surface. The switching elements are connected to the conductive member. The first input terminal, including a first terminal portion, is connected to the conductive member. The second input terminal, including a second terminal portion overlapping with the first terminal portion in the thickness direction, is connected to the switching elements. The second input terminal is separate from the first input terminal and conductive member in the thickness direction. The bus bar includes first/second terminals. The second terminal, separate from the first terminal in the thickness direction, partially overlaps with the first terminal in the thickness direction. The first/second terminals are connected to the first/second terminal portions, respectively.