Stacked Camera Module Layout for Slim Bezel Imaging

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Solution Overview

Problem

The challenge of miniaturizing camera modules with high-resolution image sensors in mobile devices is exacerbated by the increased size of the bezel, which hinders device miniaturization and introduces optical tilt issues.

Innovation Solution

A camera module design featuring a lens moving device with a bobbin, coils, magnets, and elastic members, coupled with image sensors and holders using conductive adhesives, and a reinforcement member to create a slim structure, reducing the overall thickness and eliminating the need for separate wires or solder.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a high-resolution image sensor is installed to support high-definition video communication, then image quality is improved, but the bezel size increases and device miniaturization becomes difficult

Engineering Contradiction:

Improveimage qualityVSAvoidbezel size

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar arrangement to a three-dimensional stacked configuration, positioning the image sensor between the first and second circuit boards in the vertical dimension. This allows high-resolution imaging capability while maintaining a compact footprint, effectively resolving the contradiction between image quality and device size.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The image sensor is nested within the camera module structure, specifically positioned between the circuit boards rather than occupying lateral space in the bezel. This nested arrangement enables high-resolution functionality while minimizing the overall device footprint.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If conventional mounting methods with separate wires and solder are used, then electrical connection is achieved, but the manufacturing process becomes complex and thermal damage occurs

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the electrical connection function into the adhesive material itself by using conductive adhesive to bond the image sensor to the circuit board. This eliminates the need for separate wires and solder joints, simplifying the manufacturing process while maintaining reliable electrical connectivity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the mechanical wiring and soldering system with a chemical bonding system using conductive adhesive. This substitution eliminates complex mechanical assembly steps and reduces thermal damage associated with high-temperature soldering processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If the image sensor is mounted on the circuit board using conventional methods, then electrical connection is established, but thermal damage occurs during soldering

Engineering Contradiction:

Improveelectrical connectionVSAvoidthermal damage

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent replaces the thermal soldering process with a lower-temperature adhesive bonding process. The conductive adhesive establishes electrical connections without requiring the high temperatures that cause thermal damage to sensitive image sensor components.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The conductive adhesive serves as an intermediary material between the image sensor and circuit board, providing both mechanical bonding and electrical connectivity functions while avoiding the thermal damage associated with direct soldering to the sensor.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the camera module's size and thickness, simplifies the manufacturing process, and minimizes thermal damage, enabling high-resolution imaging while allowing for device miniaturization and improved optical stability.

Implementation Method 1

the first holder and the second holder are coupled and electrically connected to each other by a conductive adhesive

Methodology Applied

Scientific EffectConduction (electrical): Conduction (electrical)

Implementation Method 2

a lens moving device including a base provided at an underside thereof; a first holder coupled to the base and provided with a filter

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS12452514B2Camera module having image sensor located between first and second circuit boards

Publication Date: 2025.10.21 LG INNOTEK CO LTD

AI summary

A camera module includes a lens driving device having a housing, a first circuit board disposed below the housing, a filter disposed on an upper surface of the first circuit board, a second circuit board disposed below the first circuit board, an image sensor disposed on the second circuit board and coupled to a lower surface of the first circuit board, and a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board. A lower surface of the image sensor is higher than the upper surface of the second circuit board.