Stacked Camera Module Layout to Cut Bezel Size and Optical Tilt
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Solution Overview
Problem
The challenge of miniaturizing camera modules with high-resolution image sensors in mobile devices is exacerbated by the increased size of the bezel, which hinders device miniaturization and introduces optical tilt issues.
Innovation Solution
A camera module design featuring a lens moving device with a bobbin, coils, magnets, and elastic members, coupled with holders using anisotropic conductive film (ACF) for electrical connections, and a reinforcement member to accommodate the image sensor, reducing the overall thickness and eliminating the need for separate wires or solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a high-resolution image sensor is installed to support high-definition video communication, then the image quality and resolution are improved, but the size of the bezel increases and device miniaturization becomes difficult
Solution Approach 1:
The patent transitions from a planar arrangement where the image sensor is mounted on the bezel to a three-dimensional stacked configuration. The image sensor is positioned between the first and second circuit boards, utilizing the vertical dimension (thickness direction) rather than expanding the horizontal bezel area. This dimensional shift allows high-resolution imaging capability while maintaining a compact bezel footprint.
Solution Approach 2:
The image sensor is nested within the camera module structure, specifically positioned between the first circuit board (with lens moving device) and the second circuit board. This nested arrangement integrates the image sensor into the existing module hierarchy, allowing it to occupy space that would otherwise be unused, thereby achieving high resolution without increasing the external dimensions of the bezel.
2Reliability
If the image sensor is mounted on the bezel, then the optical path is established, but optical tilt occurs due to shaking and the structure becomes complex
Solution Approach 1:
The patent merges the image sensor mounting function with the existing circuit board structure. Instead of separately mounting the image sensor on the bezel, it is integrated between the first and second circuit boards, combining the optical mounting function with the electrical connection function. This reduces the number of separate mounting structures and simplifies the overall assembly while improving stability against optical tilt.
Solution Approach 2:
The first and second circuit boards serve as intermediary structures that hold the image sensor in a stable position. These circuit boards act as rigid mediators between the lens moving device and the image sensor, providing a stable optical path that is less susceptible to shaking-induced tilt compared to direct bezel mounting.
3Ease of manufacture
If conventional mounting methods are used with separate wires and solder, then electrical connections are established, but the manufacturing process becomes complex and thickness increases
Solution Approach 1:
The patent combines the electrical connection function with the mechanical mounting structure. The first and second circuit boards provide both structural support for the image sensor and electrical connectivity, eliminating the need for separate wires and solder joints. This integration simplifies the manufacturing process by reducing the number of assembly steps and materials required.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate components such as separate wires and solder from the electrical connection path. By using the circuit boards themselves as the connection medium, the design removes redundant elements that would otherwise increase manufacturing complexity and add to the overall module thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a slim camera module structure with reduced thickness, simplified manufacturing, and enhanced stability against optical tilt, enabling high-resolution imaging while allowing for device miniaturization.
Implementation Method 1
The first holder and the second holder are coupled and electrically connected to each other by a conductive adhesive
Implementation Method 2
a lens moving device including a base provided at an underside thereof
Data Source
AI summary
A camera module includes a ceramic printed circuit board, an image sensor disposed under the ceramic printed circuit board, and a printed circuit board disposed under the ceramic printed circuit board so as to be spaced apart from the image sensor. The ceramic printed circuit board includes a cavity formed in a lower surface thereof and having a bottom surface and a side surface. The image sensor is disposed in the cavity of the ceramic printed circuit board and flip-chip bonded to the bottom surface of the cavity of the ceramic printed circuit board.