Stacked Insulating Cap Groove for Wire Embedding
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Solution Overview
Problem
Existing methods for manufacturing caps for electronic chips lack reproducibility and precision in embedding wired elements, leading to inconsistent electrical connections.
Innovation Solution
The cap is constructed using a stack of electrically insulating layers with integrated electrical bump contacts and connection terminals, allowing for precise and reproducible assembly with chipped elements, and featuring an electrical link element that separates the connection terminal from the wired element, ensuring reliable electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a cap is manufactured by directly moulding on the chipped element through hardening of material, then the cap can be produced integrally with the chipped element, but the manufacturing process is complex and lacks independent manufacturing capability
Solution Approach 1:
The cap is divided into multiple separate layers (first electrically insulating layer, second electrically insulating layer, third electrically insulating layer) that can be manufactured independently and then assembled together. This segmentation enables independent manufacturing of each layer while simplifying the overall production process, as each layer can be produced using standard PCB fabrication techniques rather than requiring complex integral moulding.
Solution Approach 2:
The electrical link element is pre-formed and inserted between the insulating layers before final assembly. The connection terminals are also pre-formed on the layers. This preliminary preparation of components allows for independent manufacturing and quality control of each element separately, while ensuring proper integration during assembly.
2Reliability
If the groove dimensions are made precise and reproducible to ensure correct embedding and electrical contact, then the electrical contact quality improves, but the manufacturing complexity increases
Solution Approach 1:
The cap structure is segmented into multiple layers with standardized dimensions. The first, second, and third insulating layers each have defined thicknesses and dimensions that can be precisely controlled during manufacturing. This segmentation allows for reproducible groove dimensions through standard fabrication processes, ensuring consistent electrical contact quality without requiring complex overall device manufacturing.
Solution Approach 2:
The invention specifies precise parameter ranges for the cap layers (thicknesses of 10-100 micrometers for insulating layers, specific width and length dimensions) that can be reliably manufactured using standard PCB techniques. By defining these parameters, the invention achieves reproducible groove dimensions and electrical contact quality through conventional manufacturing capabilities rather than requiring complex precision engineering.
3Reliability
If multiple electrical connection elements are integrated within the cap structure to link terminals, then the electrical connectivity is improved, but the device complexity increases
Solution Approach 1:
The electrical connection system is segmented into distinct components: connection terminals formed on the insulating layers, electrical link elements inserted between layers, and bump contacts on the assembly surface. Each component has a specific function and can be manufactured separately using standard techniques, reducing overall structural complexity while maintaining reliable electrical connectivity throughout the cap structure.
Solution Approach 2:
The electrical link element acts as an intermediary component that bridges the connection terminals on different layers. This separate intermediary element simplifies the overall structure by providing a dedicated connection path between layers, rather than requiring complex integrated trace routing within the insulating material itself.
Data Source
AI summary
The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5′) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).