Stacked Capacitive Sensor Module with Single-IC Force Scanning
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Solution Overview
Problem
Existing sensor modules with separate sensor integrated circuits for detection units complicate the configuration, leading to increased complexity and potential detection speed decreases due to calculation delays.
Innovation Solution
A sensor module with a stacked configuration of sensor layers separated by a separation layer, using a single integrated circuit to scan detection units, allowing for the detection of three-axis forces and shearing forces with a simplified and space-saving design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate sensor integrated circuits are used to scan detection units, then detection accuracy can be maintained, but device complexity increases
Solution Approach 1:
The patent merges multiple sensor integrated circuits into a single sensor integrated circuit that scans multiple detection units sequentially. This consolidation reduces the number of separate circuits from multiple to one, thereby reducing device complexity while maintaining the ability to detect signals from all detection units with sufficient accuracy.
Solution Approach 2:
The single sensor integrated circuit performs periodic scanning of multiple detection units in sequence rather than simultaneously detecting all units. This time-division multiplexing approach allows one circuit to service multiple detection units through repeated scanning cycles, reducing hardware complexity while preserving detection capabilities.
2Reliability
If separate sensor integrated circuits are used to scan detection units, then detection capability is maintained, but processing speed decreases due to calculation delays
Solution Approach 1:
By consolidating multiple sensor integrated circuits into one, the patent reduces the total number of circuits that need to be coordinated and processed. This single circuit architecture simplifies data processing and reduces calculation delays associated with multiple separate circuits, thereby improving detection speed while maintaining reliable detection capability.
Solution Approach 2:
The periodic scanning mechanism allows the single sensor integrated circuit to systematically cycle through detection units, enabling efficient time-ordered processing of detection signals. This structured periodic approach optimizes processing speed by eliminating the coordination overhead and calculation delays inherent in simultaneous multi-circuit operations.
3Device complexity
If a stacked sensor layer configuration is used, then device complexity is reduced, but space utilization must be optimized
Solution Approach 1:
The patent transitions from a planar arrangement of detection units to a stacked three-dimensional configuration where detection units are arranged across multiple layers separated by a separation layer. This vertical stacking in the thickness direction reduces the horizontal footprint and optimizes space utilization while maintaining a simple configuration through the use of a single scanning circuit.
Solution Approach 2:
The stacked sensor layer configuration nests multiple detection units and sensor layers within a compact three-dimensional structure. By placing detection units at different heights and using a single integrated circuit to scan through all layers, the design achieves high space utilization efficiency while keeping the overall device configuration simple and manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient detection of three-axis forces and shearing forces with reduced complexity, improved detection accuracy, and faster processing times by utilizing a single integrated circuit to scan multiple detection units.
Implementation Method 1
a separation layer (24) between the first sensor layer (20A) and the second sensor layer (20B)
Implementation Method 2
capable of detecting a pressure and shearing forces acting on a surface in a surface distribution
Data Source
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AI summary
A sensor module includes a sensor that includes a first sensor layer of a capacitance type including a plurality of first detection units arranged two-dimensionally and a second sensor layer of a capacitance type including a plurality of second detection units arranged two-dimensionally, the first sensor layer being provided on the second sensor layer, and a control unit that scans the plurality of first detection units and the plurality of second detection units.