Vertically Stacked Capacitor Assembly With Grounded Coupling Shield
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for vertically stacking capacitors in RF amplifiers introduce unwanted coupling between the capacitors, which can lead to signal distortion and reduced linearity in RF amplifiers.
Innovation Solution
A capacitor assembly is designed with a vertical stacking configuration where the second grounded terminal of the first capacitor and the second grounded terminal of the second capacitor are electrically connected through a ground layer with relief openings, preventing electromagnetic coupling between the capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If capacitors are vertically stacked to achieve compact configuration, then device footprint is reduced, but unwanted coupling between capacitors is introduced
Solution Approach 1:
A ground layer is introduced as an intermediary between the first and second capacitors. This ground layer acts as a shield that prevents unwanted capacitive coupling while maintaining the vertical stacking configuration. The ground layer is connected to ground potential and positioned between the capacitive elements to block electromagnetic field interaction.
Solution Approach 2:
The vertical stacking structure is segmented into distinct regions with the ground layer creating separation between the first capacitor (with relief openings) and the second capacitor. This segmentation isolates the capacitive elements electrically while maintaining physical proximity for compact layout.
2Object-generated harmful factors
If relief openings are added to conductive layers to prevent coupling, then capacitive coupling is reduced, but manufacturing complexity increases
Solution Approach 1:
The relief openings in the first conductive layer and the ground layer are merged/aligned in the same vertical region. This combined approach creates an effective shield against capacitive coupling while using standard semiconductor fabrication techniques for forming openings in multiple layers, avoiding the need for complex additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed capacitor assembly effectively reduces capacitive coupling between the first and second capacitors while maintaining high manufacturability and reliability, thereby improving the linearity and performance of RF amplifiers.
Implementation Method 1
The proposed capacitor assembly effectively reduces capacitive coupling between the first and second capacitors
Data Source
AI summary
Example embodiments relate to vertically stacked capacitors. One capacitor assembly includes a vertical stacking of a first capacitor and a second capacitor on a substrate. The first capacitor includes a first terminal and a second terminal. The second terminal is formed by a first conductive layer that includes stress relief openings. The second capacitor includes a first terminal and a second terminal. The second terminal of the first capacitor lies below the first terminal of the first capacitor. The second terminal of the second capacitor lies below the first terminal of the second capacitor. The second capacitor lies below the first capacitor. The capacitor assembly further includes a ground layer. The second terminal of the second capacitor is electrically connected to the ground layer and to the first conductive layer. The ground layer includes stress relief openings. The ground layer is configured to be electrically grounded during operation.