Stacked Folded Capacitor Gates for Dense Low-Power Non-Volatile Memory

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Solution Overview

Problem

Conventional non-volatile memories, such as MRAM and flash memories, are not suitable for low-power and compact computing devices due to high write energy, low density, and high power consumption, and traditional ferroelectric memories suffer from charge degradation and disturbance issues.

Innovation Solution

The use of stacked and folded capacitor configurations in memory bit-cells, combined with endurance mechanisms like wear leveling, random swap injection, and error correction, to mitigate charge disturbance and improve memory endurance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional non-volatile memories (MRAM, flash) are used, then non-volatile storage is achieved, but power consumption and write energy are high

Engineering Contradiction:
Improvenon-volatile storageVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent segments the capacitor structure into multiple stacked capacitors (first capacitor and second capacitor) sharing a common bottom electrode. This segmentation allows the memory cell to achieve non-volatile storage functionality while reducing the area occupied by each individual capacitor, thereby lowering overall power consumption and enabling compact designs suitable for low-power devices.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a planar capacitor arrangement to a three-dimensional stacked configuration. By stacking capacitors vertically and sharing common electrodes, the design achieves non-volatile storage in a compact footprint, reducing the area per memory cell and enabling higher density with lower power consumption compared to conventional planar architectures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If multiple capacitors are used in memory bit-cells, then memory functionality is achieved, but area occupation increases

Engineering Contradiction:
Improvememory functionalityVSAvoidcapacitor area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges multiple capacitors into a stacked configuration where the first capacitor and second capacitor share a common bottom electrode. This merging reduces the total area occupied by capacitors in the memory bit-cell while maintaining full memory functionality, as the shared electrode serves both capacitors simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a nested capacitor structure where capacitors are stacked vertically with shared electrodes. The first capacitor and second capacitor are nested in the vertical dimension, with the bottom electrode of the upper capacitor serving as the top electrode of the lower capacitor. This nesting achieves compact area occupation while preserving memory functionality.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If traditional ferroelectric memories are used, then non-volatile storage is achieved, but charge degradation and disturbance occur

Engineering Contradiction:
Improvenon-volatile storageVSAvoidcharge stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent applies wear leveling mechanisms that redistribute write operations across different memory blocks before charge degradation occurs. By proactively balancing the wear across multiple blocks, the system prevents charge degradation and disturbance in any single block, maintaining charge stability and extending the lifespan of the ferroelectric memory.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent implements error correction codes (ECC) that continuously monitor and correct charge degradation and disturbance in ferroelectric memory. The ECC system provides feedback mechanisms that detect and correct bit errors caused by charge instability, thereby maintaining data integrity and charge stability over extended operation periods.

Inventive Principle:
Principle #23Feedback

4Quantity of substance

If memory density is increased, then storage capacity is improved, but charge disturbance increases

Engineering Contradiction:
Improvememory densityVSAvoidcharge stability
Core Design Contradiction:
Quantity of substanceVSStability of the object's composition

Solution Approach 1:

The patent segments the memory into multiple blocks and implements wear leveling that distributes write operations across these blocks. This segmentation prevents charge disturbance from concentrating in any single high-density region, maintaining charge stability even as overall memory density increases through compact stacked capacitor designs.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces power consumption, increases memory density, and enhances the reliability and endurance of non-volatile memories by minimizing charge disturbance and extending the lifespan of ferroelectric capacitors.

Implementation Method 1

an apparatus comprising memory and corresponding logic, wherein the memory comprises ferroelectric (FE) or paraelectric (PE) memory bit-cells

Methodology Applied
Scientific EffectFerroelectric polarization:

Implementation Method 2

the capacitors are in a stacked and folded configuration

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS12171103B1Multi-input threshold gate having stacked and folded non-planar capacitors
Publication Date: 2024.12.17 KEPLER COMPUTING INC
  • US12171103B1 patent drawing
  • US12171103B1 patent drawing
  • US12171103B1 patent drawing

AI summary

A configuration for efficiently placing a group of capacitors with one terminal connected to a common node is described. The capacitors are stacked and folded along the common node. In a stack and fold configuration, devices are stacked vertically (directly or with a horizontal offset) with one terminal of the devices being shared to a common node, and further the capacitors are placed along both sides of the common node. The common node is a point of fold. In one example, the devices are capacitors. N number of capacitors can be divided in L number of stack layers such that there are N/L capacitors in each stacked layer. The N/L capacitors are shorted together with an electrode (e.g., bottom electrode). The electrode can be metal, a conducting oxide, or a combination of a conducting oxide and a barrier material. The capacitors can be planar, non-planar or replaced by memory elements.