Stacked Capacitor Interposer Layout for Compact Semiconductor Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in reducing the longitudinal footprint of stacked capacitors, which limits the overall size and space for additional electrical connections and increases the risk of wire damage during manufacturing.
Innovation Solution
The implementation of vertically aligned stacked capacitors with an interposer, where the first and second capacitors are at least partially aligned, reducing the longitudinal footprint and allowing for additional space for electrical connections and minimizing wire damage through optimized bonding structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are placed side-by-side in a stacked configuration, then electrical connectivity is enhanced, but the longitudinal footprint increases
Solution Approach 1:
The patent transitions from a lateral side-by-side capacitor arrangement to a vertical stacking configuration, utilizing the third dimension (height) to accommodate multiple capacitors. This dimensional change allows capacitors to be stacked one above another rather than placed adjacent to each other horizontally, thereby reducing the longitudinal footprint while maintaining electrical connectivity through vertical interconnections.
Solution Approach 2:
The patent implements a nested structure where capacitors are stacked vertically with one capacitor positioned above another, similar to nested dolls. The lower capacitor serves as a base for the upper capacitor, with interconnect structures extending vertically between them. This nesting approach consolidates multiple capacitor components into a compact vertical arrangement, minimizing the horizontal space required.
2Length of stationary object
If the longitudinal footprint is reduced by vertical stacking, then device size decreases, but wire damage risk increases during manufacturing
Solution Approach 1:
The patent introduces an interposer structure as an intermediary component between the stacked capacitors and the substrate. This interposer serves as a mediator that provides robust electrical interconnections and mechanical support, reducing the stress and damage risk to bond wires during the manufacturing process. The interposer acts as a buffer that protects the delicate wire bonds while enabling the compact vertical capacitor arrangement.
Solution Approach 2:
The patent employs protective measures in advance by incorporating the interposer structure before final assembly, which cushions and protects the bond wires from damage during subsequent manufacturing steps. The interposer is positioned beforehand to provide structural support and stress distribution, preventing wire damage before it can occur during handling and assembly operations.
3Area of stationary object
If vertical stacking with interposer is implemented, then space for electrical connections increases, but device complexity increases
Solution Approach 1:
The interposer structure serves multiple functions simultaneously: it provides electrical interconnections between stacked capacitors, offers mechanical support for bond wires, enables vertical stacking architecture, and creates additional space for electrical connections. By making the interposer a multi-functional component, the patent avoids the need for separate dedicated structures for each function, thereby managing complexity while achieving the desired space for electrical connections.
Data Source
AI summary
Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.