Stacked Capacitor Assembly Without Carbon or Silver Layers
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Solution Overview
Problem
Current capacitor technologies require complex structures with carbon-containing and silver-containing materials, which complicate the design and may not fully meet electrical characteristic requirements.
Innovation Solution
A stacked capacitor assembly and package structure that uses conductive substrates with an inner conductive structure and outermost covering structure, both devoid of carbon-containing and silver-containing materials, allowing for a simplified design while maintaining electrical performance by positioning the inner conductive structure between substrates and covering it with an outermost structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If carbon-containing materials and silver-containing materials are used in the capacitor structure, then electrical characteristics can be maintained, but the structure becomes complex and manufacturing difficulty increases
Solution Approach 1:
The patent removes carbon-containing materials and silver-containing materials from the capacitor structure, extracting the problematic elements that caused structural complexity while maintaining electrical performance through alternative material compositions in the inner conductive structure and insulating resin
Solution Approach 2:
The patent changes the material composition parameters by eliminating carbon and silver-containing materials, and instead using alternative conductive materials and insulating resin formulations to achieve the desired electrical characteristics without the complexity associated with traditional materials
2Ease of manufacture
If a simplified capacitor structure is used, then manufacturing is easier, but electrical characteristic requirements may not be fully met
Solution Approach 1:
The patent merges the inner conductive structure with the insulating resin to form an integrated insulating resin layer that combines both electrical functionality and structural support, simplifying the manufacturing process while ensuring electrical characteristic requirements are met through the unified design
3Volume of moving object
If the inner conductive structure is positioned between adjacent conductive substrates, then space utilization is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the capacitor structure into distinct layers including the inner conductive structure positioned between conductive substrates, with each layer having defined spatial relationships that optimize space utilization while maintaining manufacturability through clear structural boundaries
Data Source
AI summary
A stacked capacitor assembly and a method of manufacturing the same, and a stacked capacitor package structure are provided. The stacked capacitor assembly includes a plurality of conductive substrates, an inner conductive structure and an outermost covering structure. Each of the conductive substrates has a first portion and a second portion opposite to the first portion. The inner conductive structure is configured to cover the first portion of each of the conductive substrates and be disposed between any two adjacent ones of the conductive substrates. The outermost covering structure is configured to cover the inner conductive structure. The inner conductive structure is provided without carbon-containing materials or silver-containing materials, and a space is formed between any two adjacent ones of the conductive substrates without carbon-containing materials or silver-containing materials.