Stacked Capacitor Terminals for Low-Inductance Semiconductor Modules
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Solution Overview
Problem
Conventional semiconductor devices experience increased inductance due to extended wiring between the semiconductor module and capacitor, limiting the effectiveness of existing connection methods, which do not adequately reduce inductance on the capacitor side.
Innovation Solution
A semiconductor device design featuring a capacitor with a case, first and second connection terminals, and a flexible insulating member, along with a semiconductor module having multi-layer terminal portions, where the terminals are stacked and connected using coupling members with laser welding, minimizing wiring length and inductance by arranging the connection terminals in parallel to offset magnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If screw-based connection method is used between semiconductor module and capacitor, then connection process is facilitated and ease of manufacture is improved, but wiring length is extended and inductance is increased
Solution Approach 1:
The patent replaces the screw-based mechanical connection system with a direct bonding connection system. The connection terminals are directly bonded to the power terminals through laser welding or similar bonding processes, eliminating the need for screws and associated wiring, thereby reducing inductance while maintaining manufacturing feasibility
Solution Approach 2:
The patent transitions from a planar connection layout to a three-dimensional stacked configuration. Connection terminals and power terminals are arranged in multiple layers and directly bonded across layers, reducing the wiring path length from a two-dimensional extended route to a compact three-dimensional direct connection, thereby reducing inductance
2Object-affected harmful factors
If connection terminals are arranged in parallel configuration, then magnetic fields are offset and inductance is reduced, but manufacturing precision requirements are increased
Solution Approach 1:
The patent divides the connection structure into multiple segmented terminals arranged in parallel. Each terminal pair (connection terminal and corresponding power terminal) is independently bonded, allowing for localized precision control and compensation for cumulative alignment errors across multiple bonding points
Solution Approach 2:
The patent introduces an insulating member as an intermediary element between the connection terminals and power terminals. This insulating member provides a standardized bonding surface and positioning structure that facilitates precise alignment during the bonding process while maintaining the parallel configuration for magnetic field offset
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces inductance between the semiconductor module and capacitor, improving the semiconductor device's performance compared to traditional screw-based connections by maintaining insulation and minimizing wiring length.
Implementation Method 1
a flexible insulating member disposed between the first connection terminal and the second connection terminal
Implementation Method 2
the terminals are stacked and connected using coupling members with laser welding
Data Source
AI summary
A capacitor includes a case including a capacitor element, a first connection terminal, a second connection terminal, and a second insulating sheet formed between the first connection terminal and the second connection terminal, and the first connection terminal, the second insulating sheet, and the second connection terminal extend to the outside from the case. A semiconductor module includes a multi-layer terminal portion in which a first power terminal, a first insulating sheet, and a second power terminal are sequentially stacked. The first power terminal includes a first bonding area electrically connected to the first connection terminal, and the second power terminal includes a second bonding area electrically connected to the second connection terminal. The first insulating sheet includes a terrace portion that extends in a direction from the second bonding area towards the first bonding area in a planar view.