Stacked Capacitor Tracker Module for Low-Parasitic Power Modulation
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Solution Overview
Problem
Existing tracker modules with switched-capacitor circuits face issues of increased size and deteriorated output characteristics due to resistance and parasitic capacitance in wiring, which affect the performance of power supply modulation.
Innovation Solution
A tracker module design where capacitors are stacked on the IC chip, reducing wiring length and parasitic capacitance, and the IC chip is positioned between capacitors and the board to minimize these effects, thereby enhancing output characteristics and reducing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are disposed on the board in a conventional switched-capacitor circuit, then the circuit can generate discrete voltages, but the wiring portion increases in length causing resistance and parasitic capacitance that deteriorate output characteristics
Solution Approach 1:
The patent merges the capacitor components with the IC chip by stacking capacitors directly on the IC chip substrate. This integration eliminates separate wiring connections between discrete capacitors and the IC chip, thereby reducing wiring length and minimizing parasitic effects while maintaining the voltage generation function.
Solution Approach 2:
The patent transitions from a planar arrangement where capacitors are disposed on the board to a three-dimensional stacked configuration where capacitors are positioned vertically on the IC chip. This dimensional change reduces the horizontal wiring distance and minimizes parasitic capacitance in the wiring portion.
2Productivity
If a conventional tracker module configuration is used with separate capacitors and wiring, then the circuit functionality is maintained, but the overall module size increases
Solution Approach 1:
The patent combines multiple components (IC chip and capacitors) into a single integrated structure where capacitors are stacked on the IC chip. This merger reduces the overall component count and eliminates the need for extensive wiring, thereby reducing the tracker module's volume while maintaining power supply modulation efficiency.
Solution Approach 2:
The patent implements a nested configuration where capacitors are stacked on top of the IC chip, creating a compact vertical arrangement. This nesting approach allows components to occupy overlapping spatial footprints, significantly reducing the horizontal area required for the tracker module.
3Reliability
If wiring length is reduced by stacking capacitors on the IC chip, then parasitic capacitance decreases improving output characteristics, but the IC chip must be positioned between capacitors and board increasing assembly complexity
Solution Approach 1:
The patent merges the capacitor assembly with the IC chip into a single integrated unit. The capacitors are stacked directly on the IC chip substrate, creating a unified component assembly that simplifies the overall structure despite the vertical arrangement, as the capacitors and IC chip form an integrated module rather than separate components requiring complex interconnection.
Data Source
AI summary
A tracker module is provided that includes a board, an IC chip, and at least one capacitor included in a switched-capacitor circuit. The IC chip is disposed at the board. The switched-capacitor circuit is configured to generate a plurality of discrete voltages based on an input voltage. The IC chip includes at least one switch included in a switched-capacitor circuit and at least one switch included in a supply modulator. The supply modulator selectively outputs at least one of the plurality of discrete voltages to a power amplifier. The at least one capacitor is stacked on the IC chip.