Stacked Carrier Package Structure for Power and Driving Circuit Integration
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Solution Overview
Problem
Conventional power converter package structures using direct bonded copper substrates are limited in current-flowing capability and heat-dissipating efficiency, making them unsuitable for integrating driving circuits, which restricts power density and size reduction.
Innovation Solution
A package structure with a first carrier plate for power components with high current-flowing and heat-dissipating capability, and a second carrier plate with high trace density for the driving circuit, where the power component is accommodated within an opening on the second carrier plate, reducing volume and enhancing heat-dissipating efficiency, and shortening the electric connection distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a direct bonded copper substrate is used as the installation carrier for power components, then the current-flowing capability and heat-dissipating efficiency are improved, but the trace density is insufficient and the driving circuit cannot be integrated into the package structure
Solution Approach 1:
The package structure is divided into two distinct carrier substrates: a first carrier substrate optimized for power components with high current-flowing capability and heat dissipation, and a second carrier substrate optimized for the driving circuit with high trace density. This segmentation allows each substrate to be specialized for its specific function without compromise.
Solution Approach 2:
The invention transitions from a conventional single-plane package structure to a stacked three-dimensional structure where the first and second carrier substrates are arranged in different layers and connected through vertical vias. This dimensional change enables both high current capability and high trace density to coexist by utilizing spatial separation.
2Reliability
If the driving circuit is located outside the package structure, then the direct bonded copper substrate can maintain its current-flowing capability, but the power density is reduced and the size cannot be minimized
Solution Approach 1:
The invention merges the power component package and the driving circuit package into a single integrated package structure. The first carrier substrate carrying power components and the second carrier substrate carrying the driving circuit are stacked and electrically connected, combining both functions into one compact unit that reduces overall size while maintaining performance.
Solution Approach 2:
The driving circuit package is nested within the same package structure as the power component package. The second carrier substrate is positioned above the first carrier substrate, with the driving circuit effectively nested in the vertical space above the power components, achieving compact integration similar to nested dolls.
3Volume of moving object
If the package structure size is reduced to increase power density, then the portability is improved, but the heat-dissipating efficiency requirement becomes more stringent
Solution Approach 1:
The heat dissipation function is segmented and assigned primarily to the first carrier substrate which is specifically designed with high thermal conductivity materials and structures. By separating the heat dissipation responsibility from the signal processing function (driving circuit), the package can be miniimized while maintaining effective heat management through the specialized first carrier substrate.
Data Source
AI summary
A package structure includes a first carrier plate, a second carrier plate, a pin group and an encapsulant member. A power component is disposed on a first top surface of the first carrier plate. The second carrier plate is disposed on the first top surface of the first carrier plate. A driving circuit is disposed on a second top surface of the second carrier plate for driving the power component. An opening runs through the second carrier plate, and the power component is accommodated within the opening. The pin group is assembled on the first carrier plate and/or the second carrier plate. The encapsulant member encapsulates the first carrier plate, the second carrier plate, a part of the first pin group and a part of the second pin group, so that the first pin group and the second pin group are partially exposed outside the encapsulant member.