Stacked Carrier Layout for Larger Passive Elements in Compact Electronics
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Solution Overview
Problem
Existing electronic devices face challenges in simultaneously achieving a shorter distance and larger size for passive elements, which affects their performance.
Innovation Solution
The integration of a carrier with a first and second conductive element, where the electronic component receives power from the first conductive element and the second element is positioned laterally, along with redistribution structures to manage power and signal transmission, allowing for different elevations and non-solder connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the passive element size is increased to enhance performance, then the performance of the passive element is improved, but the distance between the passive element and the electronic component cannot be shortened
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional vertical stacking architecture. The passive element is positioned in a lower layer while the electronic component is placed in an upper layer, utilizing the vertical dimension to reduce the horizontal distance between them. This dimensional change allows both larger passive element size and shorter effective distance to be achieved simultaneously.
Solution Approach 2:
The patent implements a nested structure where the passive element and electronic component are vertically stacked with the smaller component positioned above the larger one. The conductive elements extend through multiple layers to establish electrical connections between the nested components, enabling compact integration while maintaining performance.
2Reliability
If the passive element size is increased to enhance performance, then the performance of the passive element is improved, but the overall device size increases
Solution Approach 1:
By utilizing vertical stacking across multiple layers, the patent accommodates larger passive elements without increasing the horizontal footprint of the device. The volume is efficiently utilized by distributing components across different vertical levels, allowing large passive elements to be integrated while maintaining a compact overall device size.
Solution Approach 2:
The patent combines multiple functional elements (passive element, electronic component, conductive elements) into a single integrated multi-layer structure. This merging of components into a compact stacked assembly reduces the overall device volume while maintaining the performance benefits of larger passive elements.
3Ease of manufacture
If traditional integration methods are used, then manufacturing is simpler, but the distance and size requirements for passive elements cannot be simultaneously satisfied
Solution Approach 1:
The patent divides the device into distinct manufacturing layers, with each layer containing specific components (passive elements in lower layers, electronic components in upper layers). This segmentation allows each layer to be manufactured and optimized independently, then assembled through vertical stacking, thereby achieving precise control over distances and sizes while maintaining manufacturing feasibility.
Solution Approach 2:
The multi-layer vertical architecture enables independent optimization of each layer during manufacturing. By separating component placement into different vertical levels, the patent achieves precise control over inter-component distances and passive element sizes without significantly complicating the manufacturing process, as each layer can be processed using standard techniques.
Data Source
AI summary
An electronic device is provided. The electronic device includes a carrier having a first conductive element, an electronic component, and a second conductive element. The first conductive element is exposed by a lower surface of the carrier. The electronic component is disposed over the carrier and configured to receive a power from the first conductive element. The second conductive element is disposed at a lateral side of the carrier and protruding downwardly below the lower surface of the carrier.