Stacked Component Carrier With Conductive Paste Interconnects
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Solution Overview
Problem
Existing component carriers face challenges in managing increasing complexity and miniaturization of electronic components, particularly in terms of heat removal, mechanical robustness, electrical reliability, and yield loss, especially when connecting valuable components like microprocessor chips.
Innovation Solution
A component carrier design with a stack of insulating and conductive layer structures, where components are embedded one above the other with a cavity filled with conductive paste, allowing direct and straight electrical connections, reducing height, and enhancing thermal management and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are connected using conventional routing methods, then electrical connections can be established, but the connection paths become long and complex, increasing inductance and parasitics
Solution Approach 1:
The patent transitions from planar 2D routing to 3D vertical stacking, allowing electrical connections to be made directly between components in the stacking direction. This dimensional change enables short and straight connection paths through conductive paste filling cavities between stacked components, eliminating long lateral routing paths and reducing inductance and parasitics while improving electrical reliability.
2Volume of moving object
If multiple components are stacked vertically, then the height is reduced and miniaturization is achieved, but heat removal becomes more difficult
Solution Approach 1:
The patent applies different material properties to different regions: the conductive paste material is specifically selected to have high thermal conductivity for heat removal from component hotspots, while the insulating layer structures provide electrical insulation. This local quality differentiation allows vertical stacking for miniaturization while addressing heat dissipation through thermally conductive paste in critical thermal zones.
3Reliability
If conductive paste is used to fill cavities between stacked components, then direct electrical connections are achieved with reduced inductance, but the mechanical robustness may be compromised
Solution Approach 1:
The patent employs composite material structures combining conductive paste with insulating layer structures and support elements. The conductive paste provides electrical connectivity while the composite construction with insulating layers and mechanical support features enhances overall mechanical robustness, allowing the assembly to withstand handling and mounting stresses while maintaining electrical connection quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves miniaturization, improves electrical performance with reduced inductance and parasitics, enhances thermal management, and increases mechanical stability, while maintaining flexibility for various applications.
Implementation Method 1
said cavity is filled with an electrically conductive paste
Data Source
Figure 1a~1b
Figure 2
Figure 3
AI summary
The present invention relates to a component carrier (100), a method for manufacturing thereof and to a package comprising such a component carrier (100), wherein the component carrier (100) comprises a stack (10, 20) having a stacking direction (Z) and comprises at least one electrically insulating layer structure and at least one electrically conductive layer structure, and further comprising at least a first component (11) and a second component (12) embedded in said stack (10, 20) one above the other in said stacking direction (Z) with a cavity (13) in between, wherein the first component (11) and the second component (12) each comprise a component main surface (14, 16; 24, 26) facing towards said cavity (13) and delimiting said cavity (13) in stacking direction (Z) partially, and wherein said cavity (13) is filled with an electrically conductive paste.