Stacked Circuit Carrier Temperature Sensing for Power Modules
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Solution Overview
Problem
Current temperature monitoring solutions in power modules are hindered by increased area requirements, cost, complexity, and inaccuracy, making them ineffective for precise heat-generated element temperature measurement.
Innovation Solution
A semiconductor module with a stacked arrangement of circuit carriers, where temperature sensors are fixedly attached to the upper circuit carrier and positioned in close proximity to heat generating elements on the lower circuit carrier, using a dielectric material like a potting compound to encapsulate these elements for direct temperature measurement, thereby eliminating the need for additional temperature sensing elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are placed close to heat generating elements for direct temperature measurement, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The temperature sensor is integrated into the circuit carrier substrate itself, merging the sensing function with the existing structural component. This eliminates the need for separate sensor housings and mounting mechanisms, reducing device complexity while maintaining close proximity to heat generating elements for accurate temperature measurement.
Solution Approach 2:
The circuit carrier substrate serves multiple functions: it provides electrical connections, mechanical support, and houses the temperature sensor. This multi-functionality reduces the overall number of components needed in the power module, simplifying the device structure while enabling direct temperature monitoring near power devices.
2Measurement precision
If additional temperature sensing elements are added to power modules, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
The temperature sensor is fabricated using the same semiconductor manufacturing processes as the power devices themselves, combining multiple functions into a single integrated structure. This approach eliminates the need for separate sensor procurement and assembly steps, reducing manufacturing cost while providing accurate temperature measurements.
Solution Approach 2:
The circuit carrier substrate automatically provides the mounting structure and electrical connections for the temperature sensor during the same manufacturing process that creates the power devices. This self-service approach eliminates additional assembly steps and reduces overall manufacturing complexity and cost.
3Measurement precision
If temperature sensors are positioned close to heat generating elements, then measurement precision is improved, but area requirements increase
Solution Approach 1:
The temperature sensor utilizes the vertical dimension by being positioned on the same circuit carrier substrate as the power devices, allowing close thermal coupling without requiring additional lateral space. This three-dimensional integration enables accurate temperature monitoring while maintaining a compact module footprint.
Solution Approach 2:
The temperature sensor shares the same substrate and packaging structure as the power devices, merging multiple functions into the existing spatial framework. This integration eliminates the need for separate sensor mounting areas, reducing the overall module area while maintaining close proximity for accurate temperature measurement.
4Reliability
If multiple temperature sensing elements are incorporated into power modules, then reliability is improved, but device complexity increases
Solution Approach 1:
The temperature monitoring function is divided into multiple discrete sensor elements distributed across the circuit carrier substrate, each monitoring specific heat generating elements. This segmentation allows for targeted temperature monitoring of critical areas while using simple, standardized sensor structures, improving reliability without significantly increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size and cost of the semiconductor module while providing accurate direct temperature measurements of heat generating elements, enhancing the reliability and longevity of power modules by effectively monitoring temperature.
Implementation Method 1
a dielectric material that fills a space between the temperature sensor and the first one of the heat generating elements
Implementation Method 2
the dielectric material is a potting compound that encapsulates each of the one or more heat generating elements
Data Source
Figure 1
Figure 2
AI summary
A semiconductor module includes a first circuit carrier including one or more heat generating elements mounted on an upper surface of the first circuit carrier, a second circuit carrier mounted over the first circuit carrier and being vertically spaced apart from the upper surface of the first circuit carrier, and a temperature sensor that is fixedly attached to the second circuit carrier and is arranged in a vertical space between the lower surface of the second circuit carrier and the upper surface of the first circuit carrier, wherein the temperature sensor is arranged in sufficient proximity to a first one of the heat generating elements to obtain a direct temperature measurement from the first one of the heat generating elements.