Stacked Semiconductor Chip Aperture Thermal Management
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Solution Overview
Problem
Stacked semiconductor chip devices face challenges in electrical interfacing, thermal management, and early defect identification, which affect the efficiency and cost of the manufacturing process due to heat dissipation and the need for active thermal management during testing.
Innovation Solution
A method involving a substrate with an aperture to accommodate a thermal management device in thermal contact with the semiconductor chip, allowing for effective heat dissipation and reduced form factor, while enabling early defect identification and efficient assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal management device is added to the stacked semiconductor chip device, then thermal management capability is improved, but device complexity increases
Solution Approach 1:
The thermal management device is integrated with the substrate structure by forming the thermal via directly through the substrate during fabrication. This merging of the thermal management function into the existing substrate eliminates the need for separate thermal management components, thereby improving thermal management capability while avoiding increased device complexity.
2Length of stationary object
If the substrate is made thinner to reduce form factor, then the form factor is reduced, but it becomes more difficult to establish thermal contact between the substrate and the heat sink
Solution Approach 1:
The thermal via is formed through the substrate during the substrate fabrication process itself, before the chip stacking and heat sink attachment. This preliminary action ensures that the thermal conduction path is pre-established and integrated into the substrate structure, allowing thin substrates to maintain reliable thermal contact with heat sinks without compromising thermal management effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal management, reduces the form factor, and allows for early defect detection, thereby optimizing the manufacturing process and improving the reliability of stacked semiconductor chip devices.
Implementation Method 1
A thermal management device is placed in thermal contact with the first semiconductor chip by way of the first aperture
Data Source
AI summary
A method of manufacturing is provided that includes placing a thermal management device in thermal contact with a first semiconductor chip of a semiconductor chip device. The semiconductor chip device includes a first substrate coupled to the first semiconductor chip. The first substrate has a first aperture. At least one of the first semiconductor chip and the thermal management device is at least partially positioned in the first aperture.