Stacked Multi-Chip Capsule Camera for Compact Storage

The patent transitions from planar chip arrangement to three-dimensional stacked packaging, where multiple memory chips and processing chips are vertically stacked and interconnected through TSV (through-silicon via) technology. This dimensional change allows sufficient storage capacity and processing power to be achieved within a dramatically reduced footprint, enabling the capsule to maintain small size while accommodating multiple high-capacity memory chips and processing units.

The patent implements nested packaging where smaller components are integrated within larger structures. Multiple memory chips are stacked within a compact package, with each chip containing embedded storage layers. The processing chips are nested within the same vertical stack, creating a densely integrated multi-chip module that maximizes component density while minimizing overall capsule volume.

The patent merges multiple separate chip interconnection functions into a unified TSV-based interconnect structure. Through-silicon vias provide both mechanical support and electrical interconnection between stacked chips, eliminating the need for separate bonding wires or trace routing. This consolidation reduces interconnection complexity while enabling compact three-dimensional chip stacking, thereby reducing overall capsule dimensions.

The patent introduces TSV (through-silicon via) technology as an intermediary structure that facilitates communication between stacked memory chips and processing chips. These vertical interconnects act as mediators, providing efficient data pathways through the chip stack without requiring complex lateral routing. This intermediary approach simplifies the interconnection architecture while enabling compact packaging.