Stacked Chip Card Module With Calibrated Dielectric Spacer
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Solution Overview
Problem
Existing chip card designs that incorporate a dynamic CVX code display require flexible printed circuits for connection between the chip module and the display, leading to increased costs and reliability issues, as well as manufacturing challenges due to the need for precise and reliable interconnections between stacked electronic components.
Innovation Solution
An electronic module with a calibrated dielectric spacer separating two dielectric substrates, featuring through-holes or vias filled with conductive materials for electrical connections between microelectronic chips, allowing for direct and reliable interconnections without a printed circuit, enabling the integration of a second electronic component like a biometric sensor or display on the chip card.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible printed circuit is used to connect the display and the microcontroller, then the two circuits can communicate with each other, but the cost increases and the reliability decreases over time
Solution Approach 1:
The patent merges the display circuit and microcontroller into a single integrated circuit module, eliminating the need for external flexible printed circuits. The display is integrated directly onto the same substrate as the microcontroller, reducing the number of interconnections and improving reliability while lowering complexity.
Solution Approach 2:
The patent introduces a standardized interface layer that mediates between the display and microcontroller, providing a reliable connection mechanism that eliminates the need for flexible printed circuits. This interface layer serves as an intermediary structure that ensures stable electrical connections without the reliability issues of flexible circuits.
2Ease of manufacture
If a flexible printed circuit is used to connect the display and the microcontroller, then communication between circuits is enabled, but manufacturing difficulty increases and industrial yield decreases
Solution Approach 1:
By combining the display and microcontroller into a single integrated module, the patent eliminates the need for separate flexible printed circuit assembly steps. This merging simplifies the manufacturing process, enabling mass production with higher industrial yield while reducing manufacturing complexity.
3Device complexity
If two electronic integrated circuits are stacked opposite each other, then the need for flex PCB is eliminated, but precise and constant thickness control becomes difficult
Solution Approach 1:
The patent employs standardized thickness parameters for the integrated circuit substrates and spacing layers. By controlling the thickness parameters of each layer during manufacturing, the patent achieves precise and constant overall module thickness while maintaining the stacked architecture that eliminates flexible printed circuits.
4Device complexity
If two electronic integrated circuits are stacked opposite each other, then flex PCB is eliminated, but reliable and well-positioned interconnections become difficult to achieve
Solution Approach 1:
The patent introduces a standardized interface layer with predefined connection points that mediates between the display and microcontroller in the stacked architecture. This intermediary structure ensures reliable and well-positioned interconnections without requiring flexible printed circuits, as the connection points are precisely defined during manufacturing.
Data Source
AI summary
An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.