Stacked Chip Connection Electrode Plating Permeation Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the manufacturing of stacked chip devices, such as multi-layer ceramic capacitors, the plating solution often permeates the internal electrode, reducing contact efficiency and leading to capacitance deterioration and potential 'capacity zero' phenomena, while the existing methods to prevent this compromise the electrical connection quality.
Innovation Solution
The implementation of a connection electrode with a plating solution permeation preventing section and a contact reinforcement section, where the permeation preventing section extends with a thickness 20-60% smaller than the internal electrode and the contact reinforcement section extends gradually towards the external electrode, maintaining a predetermined gap to prevent solution permeation while enhancing contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connection electrode extends with the same thickness as the internal electrode to improve contact efficiency, then the contact area between connection electrode and external electrode increases, but the plating solution can permeate the internal electrode through the connection electrode during the forming process
Solution Approach 1:
The connection electrode is divided into two distinct sections: a first section with thickness equal to the internal electrode thickness (for preventing plating solution permeation), and a second section with greater thickness (for enhancing contact efficiency with external electrodes). This segmentation allows each part to fulfill its specific function independently, resolving the contradiction between preventing permeation and improving contact efficiency.
Solution Approach 2:
Different sections of the connection electrode have different thicknesses tailored to their specific functional requirements. The first section has thickness matching the internal electrode to prevent plating solution permeation at the critical interface, while the second section has increased thickness to maximize contact area with external electrodes. This local differentiation of properties optimizes performance for each specific function.
2Object-affected harmful factors
If the connection electrode thickness is reduced to prevent plating solution permeation, then the plating solution permeation is prevented, but the contact area between connection electrode and external electrode decreases
Solution Approach 1:
The connection electrode is divided into two distinct sections: a first section with thickness equal to the internal electrode thickness (for preventing plating solution permeation), and a second section with greater thickness (for enhancing contact efficiency with external electrodes). This segmentation allows each part to fulfill its specific function independently, resolving the contradiction between preventing permeation and improving contact efficiency.
Solution Approach 2:
Different sections of the connection electrode have different thicknesses tailored to their specific functional requirements. The first section has thickness matching the internal electrode to prevent plating solution permeation at the critical interface, while the second section has increased thickness to maximize contact area with external electrodes. This local differentiation of properties optimizes performance for each specific function.
3Reliability
If the connection electrode extends closer to the center of the dielectric sheet edge, then the contact area with external electrode increases, but the plating solution can more easily permeate the connection electrode
Solution Approach 1:
The connection electrode is divided into two distinct sections: a first section with thickness equal to the internal electrode thickness (for preventing plating solution permeation), and a second section with greater thickness (for enhancing contact efficiency with external electrodes). This segmentation allows each part to fulfill its specific function independently, resolving the contradiction between preventing permeation and improving contact efficiency.
Solution Approach 2:
Different sections of the connection electrode have different thicknesses tailored to their specific functional requirements. The first section has thickness matching the internal electrode to prevent plating solution permeation at the critical interface, while the second section has increased thickness to maximize contact area with external electrodes. This local differentiation of properties optimizes performance for each specific function.
Data Source
AI summary
Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.