Embedded Cooling Channels in Stacked Chips for Lower Thermal Resistance
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Solution Overview
Problem
Existing cooling systems for microelectronic devices suffer from high thermal resistance and inefficiency due to the design and manufacture of system components, leading to increased energy consumption and reduced performance of semiconductor devices.
Innovation Solution
Integrated cooling assemblies are embedded within device packages, featuring cooling channels between stacked semiconductor devices with spacers maintaining a close distance, allowing direct cooling and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If cooling channels are integrated between stacked semiconductor devices, then cooling efficiency is improved and thermal resistance is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the cooling channel structure with the semiconductor device stack by integrating spacers that serve dual purposes: maintaining device spacing and defining cooling channels. The spacers extend between opposing surfaces of stacked devices, collectively defining cooling channels through which coolant flows directly between devices, eliminating the need for separate cooling components and reducing overall system complexity.
Solution Approach 2:
The patent transitions from traditional planar cooling arrangements to a three-dimensional vertical cooling architecture. Cooling channels are formed between vertically stacked semiconductor devices, utilizing the Z-dimension (vertical stacking) to create direct thermal coupling paths. This dimensional change allows coolant to flow through channels positioned between devices in the stack, providing superior cooling efficiency while maintaining compact form factor.
2Reliability
If spacers are used to maintain distance between stacked devices, then interconnect performance is maintained, but thermal resistance increases
Solution Approach 1:
The patent applies local quality by positioning spacers only in specific regions where electrical isolation is required, rather than uniformly across entire device surfaces. The spacers extend between opposing surfaces at strategic locations to maintain electrical isolation and mechanical spacing, while leaving other regions open for direct thermal coupling and coolant flow, thus minimizing thermal resistance in heat transfer paths.
Solution Approach 2:
The spacers act as intermediaries that simultaneously provide electrical isolation and define cooling channel geometry. Rather than being mere barriers that increase thermal resistance, the spacers serve as structural elements that channel coolant flow directly between devices, converting a potential thermal obstacle into a thermal management enabler.
3Temperature
If direct cooling between stacked devices is implemented, then thermal resistance is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary action by forming spacers and cooling channel structures during the semiconductor fabrication process itself, before final device assembly. The spacers are integrated into the device stack architecture during manufacturing, with cooling channels pre-defined by the spacer geometry. This preliminary formation of cooling structures eliminates the need for post-assembly machining or alignment operations, reducing manufacturing precision requirements for the cooling integration step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated cooling assemblies enhance cooling efficiency by directly transferring heat between semiconductor devices, reducing thermal resistance and maintaining optimal interconnect performance while minimizing energy consumption.
Implementation Method 1
cooling channels between stacked semiconductor devices... directly transferring heat between semiconductor devices
Implementation Method 2
cooling channels... allowing direct cooling... efficiently cool the devices
Data Source
AI summary
A device package comprising an integrated cooling assembly comprising a semiconductor stack and a cooling channel, wherein the semiconductor stack comprises a first semiconductor device and a second semiconductor device stacked vertically above the first semiconductor device; and spacers extending between opposing surfaces of the first and second semiconductor devices to space the first semiconductor device away from the second semiconductor device, the spacers and the opposing surfaces of the first and second semiconductor devices collectively define the cooling channel therebetween; and the spacers comprise via electrically connecting the first semiconductor device and the second semiconductor device.