Stacked Semiconductor Package Heat Conductor for Layout Flexibility
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Solution Overview
Problem
Semiconductor devices face challenges in achieving high reliability due to limitations in heat dissipation and layout flexibility, particularly in stacked chip configurations where thick semiconductor chips can occupy central space on the wiring board, hindering efficient heat transfer and layout freedom.
Innovation Solution
Incorporating a heat conductor with a lower plate and side plate structure, bonded to the semiconductor chip and extending through a sealing insulator, which enhances heat conductivity and allows for improved heat dissipation without compromising the layout of additional semiconductor chips, using materials like copper for the heat conductor and epoxy-based resins for the insulator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thick semiconductor chips are used in stacked configurations, then the device can achieve higher integration density, but the heat dissipation performance deteriorates and layout flexibility is reduced
Solution Approach 1:
The heat conductor extends in both the thickness direction (vertical) and the plane direction (horizontal) of the wiring board. By adding the horizontal extension component, heat can be dissipated not only vertically through the stacked chips but also laterally across the wiring board plane, effectively utilizing three-dimensional space for heat transfer pathways.
Solution Approach 2:
The heat conductor is divided into multiple regions: a first region extending in the thickness direction to conduct heat between stacked chips, and a second region extending in the plane direction to dissipate heat laterally. This segmentation creates multiple heat dissipation pathways that work together to improve overall thermal management.
2Productivity
If thick semiconductor chips are used in stacked configurations, then the device can achieve higher integration density, but the layout flexibility is reduced
Solution Approach 1:
The heat conductor's extension in the plane direction allows it to reach different locations on the wiring board, enabling flexible layout arrangements. The L-shaped configuration (first region vertical + second region horizontal) provides adaptability in positioning while maintaining high integration density through vertical stacking.
3Reliability
If conventional heat dissipation structures are used, then the device structure remains simple, but the heat conductivity is insufficient
Solution Approach 1:
The heat conductor is made of a material with higher heat conductivity than the sealing insulator material. This material composition difference creates a composite structure where the heat conductor preferentially conducts heat, improving overall heat transfer efficiency without requiring complete structural redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transfers heat from the semiconductor chip to the outside, improving the reliability and layout flexibility of the semiconductor device by maintaining high heat conductivity while preventing deterioration in the degree of freedom of chip placement.
Implementation Method 1
a heat conductor provided between the sealing insulator and the second front surface and including a first region extending in a first direction which is an in-plane direction of the wiring board and a second region extending in a second direction from an end of the first region on a side of the first direction when a direction perpendicular to the in-plane direction of the wiring board and the first direction is defined as the second direction, the heat conductor having heat conductivity higher than heat conductivity of the resin
Data Source
AI summary
A semiconductor device includes a wiring board, a first semiconductor chip provided on the wiring board upwards, the first semiconductor chip including a first front surface having a connection terminal electrically connected to the wiring board and a second front surface opposite the first front surface, a chip stacked body provided on the wiring board upwards, the chip stacked body including a second semiconductor chip, a sealing insulator configured to cover the first semiconductor chip and the chip stacked body, the sealing insulator containing a resin, and a heat conductor provided between the sealing insulator and the second front surface and including a first region extending in a first direction which is an in-plane direction of the wiring board and a second region extending in a second direction from an end of the first region on a side of the first direction when a direction perpendicular to the in-plane direction of the wiring board and the first direction is defined as the second direction, the heat conductor having heat conductivity higher than heat conductivity of the resin.