Stacked Semiconductor Chip Identification via Unidirectional Through Electrodes

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In semiconductor devices using TSVs for stacking semiconductor chips, there is a challenge in efficiently transmitting chip identification information across layers while minimizing circuit size and preventing erroneous determinations due to potential defects in signal paths.

Innovation Solution

The semiconductor device employs through electrodes to transmit chip identification information in one direction, opposite to the direction of external signals, allowing the controller to recognize and verify the number of layers without the need for reverse paths, thereby reducing circuit complexity and eliminating potential errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If through electrodes are used to transmit chip identification information in bidirectional paths, then communication flexibility is improved, but circuit complexity and potential for erroneous determinations increase

Engineering Contradiction:

Improvecommunication flexibilityVSAvoidcircuit complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent inverts the conventional bidirectional communication approach by implementing unidirectional transmission for chip identification information. Instead of allowing signals to travel in both directions through the through electrodes, the system transmits identification information in one direction only (from lower to upper layers), eliminating the need for reverse paths and reducing circuit complexity while maintaining communication functionality.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent segments the signal transmission paths by direction and function. External signals and chip identification information are transmitted through separate unidirectional paths, with identification information flowing from lower to upper layers while external signals follow opposite方向的 paths. This segmentation prevents signal interference and reduces the complexity of managing bidirectional communication.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If reverse paths are provided for signal transmission, then signal routing flexibility is improved, but the risk of erroneous determinations due to defects increases

Engineering Contradiction:

Improvesignal routing flexibilityVSAvoiderror prevention

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent converts the potential harm of bidirectional signal paths (which can cause erroneous determinations) into a benefit by deliberately implementing unidirectional transmission. By restricting chip identification information to flow in one direction only, the system eliminates the risk of errors that would arise from defects in reverse paths, while still achieving reliable communication through the controlled unidirectional flow.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent applies preliminary anti-action by preventing the formation of erroneous signal paths in the first place. Instead of allowing reverse paths to exist and then trying to manage their potential errors, the system is designed from the outset to transmit chip identification information in only one direction, preemptively eliminating the possibility of erroneous determinations that could arise from bidirectional signaling.

Inventive Principle:

Principle #9Preliminary anti-action

3Device complexity

If unidirectional transmission is used for chip identification information, then circuit size is reduced, but communication versatility may be limited

Engineering Contradiction:

Improvecircuit sizeVSAvoidcommunication versatility

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent achieves universality by making the unidirectional transmission path serve multiple functions. The same through electrodes that transmit chip identification information unidirectionally also facilitate external signal transmission in the opposite direction, and enable verification of the number of upper layers. This multi-functionality compensates for the restricted unidirectional nature of identification information transmission, maintaining overall communication versatility while reducing circuit size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9773527B2Semiconductor device

Publication Date: 2017.09.26 KIOXIA CORP

AI summary

According to one embodiment, electrodes are provided in stacked M (M is an integer of 2 or more) semiconductor chips, a transmission units are provided for the semiconductor chips and, based on a chip identification information on a semiconductor chip in the present stage, transmits the chip identification information on a semiconductor chip in the next stage via the electrodes, or transmit a data for setting the chip identification information, and the direction in which an external signal is sent via the electrodes is opposite to the direction in which the chip identification information is transmitted via the electrodes.