Stacked Chip Packaging With Liquid Cooling Cavity and Conductive Columns
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Solution Overview
Problem
Conventional heat dissipation methods for three-dimensionally packaged electronic chips are inadequate, and the preparation process for micro-channel heat dissipation structures is complex and costly, hindering efficient heat management and industrial scalability.
Innovation Solution
A chip stacking and packaging structure that includes a substrate, a first chip, a heat dissipation module, and a second chip, with a heat dissipation module featuring a groove, cooling liquid cavity, liquid inlet, liquid outlet, and conductive columns, which simplifies the heat dissipation process by embedding the first chip in the groove and utilizing a cooling liquid circulation system for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a micro-channel heat dissipation structure is used, then heat dissipation efficiency is improved, but the preparation process becomes complex and costly
Solution Approach 1:
The heat dissipation structure is segmented into a substrate layer, heat dissipation layer, and insulation layer with distinct functions. The micro-channels are formed only in the heat dissipation layer rather than through the entire substrate, reducing processing complexity while maintaining heat dissipation efficiency.
Solution Approach 2:
The micro-channel structure is extracted from the substrate and relocated to a separate heat dissipation layer. This allows the substrate to maintain its original semiconductor device functions while the heat dissipation layer provides dedicated thermal management, simplifying the overall preparation process.
2Temperature
If TSV process is used to form micro channels, then heat dissipation is achieved, but process cost and manufacturing complexity increase
Solution Approach 1:
The manufacturing process is segmented into separate stages: substrate preparation, heat dissipation layer formation with micro-channels, and insulation layer addition. This segmentation allows each layer to be optimized independently and assembled, reducing overall manufacturing complexity and cost compared to forming micro-channels through the entire TSV process.
Solution Approach 2:
The micro-channels are formed preliminarily in the heat dissipation layer before the final packaging assembly. This preliminary formation allows the use of simpler etching processes rather than requiring complex TSV processes to create channels through the entire substrate thickness, reducing process cost.
3Temperature
If micro channels are etched on substrate with rewiring layer, then heat dissipation is achieved, but the preparation process becomes extremely tedious and complex
Solution Approach 1:
The heat dissipation function is extracted from the substrate structure and placed in a separate heat dissipation layer. This extraction eliminates the need to etch micro-channels through the substrate's rewiring layers, significantly reducing the number of preparation steps while maintaining effective heat dissipation.
Solution Approach 2:
Instead of forming heat dissipation structures within the substrate, the patent inverts the approach by placing the heat dissipation layer on top of the substrate. The micro-channels are formed in this upper layer, reversing the conventional approach and simplifying the preparation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure effectively dissipates heat from the first chip while simplifying the packaging process and reducing costs, ensuring efficient heat management for high-integration electronic chips.
Implementation Method 1
the cooling liquid absorbs heat generated by a device where the micro-channel heat dissipation structure is arranged
Implementation Method 2
Cooling liquid flows in from an opening on a first end of the micro channel, and the cooling liquid absorbs heat generated by a device
Implementation Method 3
Each of the first conductive columns passes through the cooling liquid cavity. A bottom end of each of the first conductive columns is electrically connected with a corresponding second bonding pad
Data Source
AI summary
A chip stacking and packaging structure includes a substrate, a first chip stacked on the substrate, a heat dissipation module, and a second chip stacked on the heat dissipation module. First bonding pads and second bonding pads are arranged on the substrate. First welding pins are arranged on the first chip. The first welding pins one-to-one cover and are one-to-one electrically connected to the first bonding pads. The heat dissipation module includes a first groove, a cooling liquid cavity, a liquid inlet, a liquid outlet, and first conductive columns. The first chip is embedded in the first groove. A side wall and a bottom wall of the first groove extend into the cooling liquid cavity. Each of the first conductive columns is electrically connected with a corresponding second bonding pad. Each of second welding pins of the second chip is electrically connected to a corresponding first conductive column.