Stacked Chip Electrode Layout for Joint Misalignment Detection

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Solution Overview

Problem

In semiconductor devices where chips are stacked on a support substrate using the chip-on-wafer method, it has been challenging to detect joint misalignment between the chips effectively.

Innovation Solution

A semiconductor device configuration that includes a first semiconductor chip with specific sensing and inspection electrodes, and a second semiconductor chip with a pad electrode, allowing for electrical detection of misalignment by determining the presence or absence of electrical conduction between these electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If chips are stacked on a support substrate by a chip-on-wafer method, then the device integration density is improved, but it becomes difficult to detect joint misalignment of the chips

Engineering Contradiction:

Improveintegration densityVSAvoidjoint misalignment detection

Core Design Contradiction:

Quantity of substanceVSMeasurement precision

Solution Approach 1:

The patent introduces sensing electrodes and inspection electrodes as intermediary elements between the stacked chips. These electrodes serve as mediators that enable indirect detection of joint misalignment through electrical conduction measurements, solving the detection difficulty while maintaining high integration density

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces optical or mechanical alignment detection methods with electrical measurement methods. By using electrical conduction between sensing and inspection electrodes to detect joint misalignment, the system achieves precise measurement without complex optical systems, enabling accurate detection in highly integrated stacked configurations

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If multiple sensing electrodes are added to detect misalignment, then the measurement precision is improved, but the device complexity increases

Engineering Contradiction:

Improvejoint misalignment detectionVSAvoidelectrode configuration

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent utilizes changes in electrical conduction parameters (conductivity, resistance) between sensing and inspection electrodes to detect joint misalignment. By monitoring electrical parameter variations rather than adding complex mechanical or optical sensors, the system achieves precise measurement while minimizing device complexity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The sensing electrodes and inspection electrodes serve multiple functions: they enable both normal device operation and joint misalignment detection. This multi-functionality allows the detection system to use existing structural elements rather than adding separate dedicated detection components, thereby improving measurement precision without proportionally increasing device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate electrical detection of misalignment between semiconductor chips, improving the reliability of chip bonding processes and reducing the risk of misalignment-related errors.

Implementation Method 1

determining whether or not joint between the above-described second semiconductor chip and each of the above-described chip regions is good on the basis of presence or absence of electrical conduction between the above-described first inspection electrode and the above-described second inspection electrode

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250201639A1Semiconductor device, manufacturing method thereof, and electronic apparatus

Publication Date: 2025.06.19 SONY SEMICON SOLUTIONS CORP

AI summary

Provided is a semiconductor device capable of detecting joint misalignment between chips. A semiconductor device includes: a first semiconductor chip including a first region and a second region that is a region other than the first region on a first joint surface; and a second semiconductor chip in which one surface is a second joint surface, and the second joint surface is bonded to the first region. The first semiconductor chip includes a first sensing electrode facing the first region, a second sensing electrode surrounding the first sensing electrode, a first inspection electrode and a second inspection electrode facing the second region, a first connection wiring line electrically connecting the first sensing electrode to the first inspection electrode, and a second connection wiring line electrically connecting the second sensing electrode to the second inspection electrode, the second semiconductor chip includes a pad electrode facing the second joint surface and connected only to the first sensing electrode out of the first sensing electrode and the second sensing electrode, and a width of the pad electrode is smaller than a distance between portions of the second sensing electrode opposed to each other with the first sensing electrode interposed in between, and is larger than a distance between the first sensing electrode and the second sensing electrode.