Stacked Integrated Circuit Chip With Optical Plate
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Solution Overview
Problem
The existing electronic devices with integrated optical sensors face limitations in miniaturization due to the need for a larger support plate for electrical connections and encapsulation, which restricts their size reduction to meet demands in portable devices like smartphones.
Innovation Solution
The design involves a chip with a substrate plate and an optical plate stacked together, where electrical connection vias pass through the substrate plate, allowing for a thinner structure and an opaque encapsulation that enables miniaturization while maintaining optical sensor functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a support plate with electrical connection wires is used to connect the chip, then the electrical connection is achieved, but the device dimensions cannot be reduced sufficiently
Solution Approach 1:
The patent merges the support plate and the chip into a single integrated component. The electrical connection network is directly formed on the back face of the chip substrate, eliminating the need for a separate support plate. This integration reduces the overall device thickness while maintaining all necessary electrical connection functions.
Solution Approach 2:
The patent extracts and eliminates the separate support plate from the device structure. By removing this redundant component and integrating its functions directly into the chip substrate, the device achieves significant thickness reduction while preserving electrical connection capabilities through vias and direct trace routing.
2Reliability
If the chip is fully encapsulated with opaque material, then the chip is protected, but the optical sensor cannot receive light
Solution Approach 1:
The patent applies local quality by making the encapsulation material transparent specifically in the region where the optical sensor is located, while maintaining opaque or protective properties in other areas. This allows light to reach the optical sensor while the rest of the chip remains protected by the encapsulation material.
Solution Approach 2:
The encapsulation is segmented into different optical property zones: a transparent region over the optical sensor for light reception, and opaque or protective regions for other chip areas. This segmentation enables simultaneous achievement of chip protection and optical sensor functionality.
3Length of moving object
If electrical connection wires extend beyond the chip front face, then connections are established, but the device cannot be miniaturized
Solution Approach 1:
The patent transitions electrical connections from a planar arrangement (wires extending on the front face) to a three-dimensional arrangement using vertical vias through the substrate. This dimensional change allows connections to be made on the back face, enabling miniaturization while maintaining manufacturing feasibility through standard via and trace techniques.
Data Source
AI summary
An electronic device is formed by a stack of an integrated circuit chip and an optical plate. The integrated circuit chip includes integrated circuits (such as optical circuits) formed on or in a semiconductor substrate plate. The optical integrated circuits may form an optical sensor. An electrical connection network is provided on the top side of the semiconductor substrate plate. Electrical connection lugs, which are connected to the electrical connection network through electrical connection vias, are mounted on the back side of the semiconductor substrate plate. The vias are through silicon vias situated at a distance from the periphery of the semiconductor substrate plate. The optical plate is configured to allow light radiation to pass to the optical integrated circuits.