Stacked Chip Package Testing and Assembly
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Solution Overview
Problem
Existing multi-chip electronic modules face limitations in electronic circuit density and reliability due to the challenges of stacking multiple dies, which increases the risk of defective modules and requires extensive testing only after assembly, leading to potential production delays and increased costs.
Innovation Solution
The development of fully testable electronic chip packages that can be stacked six or more high, allowing for individual device testing before assembly into a multi-chip module, using substrates with enhanced metallization processes and connective materials for improved mechanical and electrical connections, and hermetic packaging for reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If bare die stacking is used to create multi-chip modules, then electronic circuit density is improved and packaging size is reduced, but the risk of defective modules increases and reliability deteriorates
Solution Approach 1:
The patent implements preliminary testing of individual dies before they are stacked into multi-chip modules. Test substrates are used to electrically test each die independently prior to assembly, allowing defective dies to be identified and removed before final module construction. This preliminary action prevents defective modules while maintaining high circuit density through stacking.
2Quantity of substance
If multiple dies are stacked to increase circuit complexity, then electronic circuit density is improved, but the number of wire bonding courses increases and manufacturing complexity worsens
Solution Approach 1:
The patent introduces test substrates as intermediary components between the dies and the final module assembly. These substrates provide a platform for electrical testing and connection without requiring complex multi-course wire bonding through the entire die stack. The intermediary substrate simplifies the bonding process while enabling high-density stacking.
3Quantity of substance
If dies are stacked six or more high to achieve high density, then circuit density is improved, but the risk of defects and testing difficulty increases
Solution Approach 1:
The patent segments the testing process from the final module assembly by using separate test substrates. Each die is tested independently on its own substrate before stacking, breaking down the complex task of testing a tall die stack into manageable individual die tests. This segmentation makes testing six-or-more-high stacks feasible and reliable.
Data Source
AI summary
A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.