3D Chip Microfluidic Channel Layout for Passive Heat Transfer
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Solution Overview
Problem
Three-dimensional chips face overheating issues due to the stacking of two-dimensional integrated circuits, which can lead to thermal management challenges as the heat generated by electronic and photonic components is not effectively dissipated.
Innovation Solution
Incorporating microfluidic channel layers with working fluid that flow through and along the layers to provide passive heat transfer, potentially using oscillating heat pipes or two-phase cooling systems, along with vias for electrical signal transfer and fluid flow between circuit layers, to facilitate heat dissipation to a heat rejection surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If integrated circuit layers are stacked in three-dimensional configuration, then chip footprint is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from two-dimensional planar heat dissipation to three-dimensional heat transfer by incorporating microfluidic channels that extend through multiple stacked circuit layers. The channels include vertical portions extending through substrates and horizontal portions extending along circuit layers, enabling heat to be transported from internal heat-generating regions to external heat sinks in three-dimensional space, thereby solving the heat dissipation difficulty while maintaining the compact stacked configuration
Solution Approach 2:
The patent employs a fluid-based cooling system where a coolant flows through microfluidic channels formed within the stacked structure. The fluid absorbs heat from electronic components through thermal conduction and transports it away from the chip, effectively managing thermal loads in the three-dimensional stacked configuration. This hydraulic approach enables efficient heat removal that would be difficult to achieve with traditional air cooling or conduction-only methods
2Temperature
If microfluidic channels are integrated into chip layers, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the microfluidic channel structure: the same channels serve both as heat transfer pathways and as structural elements integrating circuit layers. The channels are formed within the substrate material itself rather than being separate components, and vias that provide electrical connections between layers also serve as fluid flow pathways, thereby reducing overall device complexity while maintaining effective heat transfer
Solution Approach 2:
The patent implements multi-functional elements where vias serve dual purposes: providing electrical signal transfer between stacked circuit layers and simultaneously serving as microfluidic channels for coolant flow and heat transfer. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure while achieving effective thermal management across the three-dimensional stack
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient passive heat transfer within the three-dimensional chip, reducing the risk of overheating and allowing for a smaller footprint compared to traditional two-dimensional chips, while also enabling electrical signal transfer through the same vias.
Implementation Method 1
the microfluidic channels are configured to enable working fluid to flow through the microfluidic channels to provide passive heat transfer means for the one or more electronic and/or photonic components
Implementation Method 2
the microfluidic channels are configured to enable heat transfer from the integrated chip layers, though the three-dimensional chip to the heat rejection surface
Implementation Method 3
The passive heat transfer means may comprise an oscillating heat pipe
Implementation Method 4
The passive heat transfer mean may comprise a two-phase cooling system
Data Source
Figure 1~2
Figure 3
Figure 4A~4E
AI summary
Examples of the disclosure relate to a three-dimensional chip. The three-dimensional chip comprises a plurality of integrated circuit layers and one or more microfluidic channel layers. The plurality of integrated circuit layers comprises one or more electronic and/or photonic components and are arranged in a stack. The one or more microfluidic channel layers are positioned between integrated circuit layers. The microfluidic channel layers comprise microfluidic channels and the microfluidic channels are configured to enable working fluid to flow through the microfluidic channels to provide passive heat transfer means for the one or more electronic and/or photonic components in the integrated circuit layers. The microfluidic channels comprise one or more portions that extend along a microfluidic channel layer and one or more portions that extend through a microfluidic channel layer.